參數(shù)資料
型號： RH80532GC033512
元件分類： 微處理器
英文描述： Microprocessor
中文描述： 微處理器
文件頁數(shù)： 85/93頁
文件大?。?/td> 2353K
代理商： RH80532GC033512
Mobile Intel
Pentium
4 Processor-M
250686-002
Datasheet
85
6.
Thermal Specifications and Design
Considerations
In order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat
pipe, or other heat transfer system) must make firm contact to the exposed processor die. The
processor die must be clean before the thermal solution is attached or the processor may be
damaged.
Table 37
provides the Thermal Design Power (TDP) dissipation and the minimum and maximum
T
J
temperatures for the Mobile Intel Pentium 4 Processor-M. A thermal solution should be
designed to ensure the junction temperature never exceeds the 100°C T
J
specification while
operating at the Thermal Design Power. Additionally, a secondary failsafe mechanism in hardware
must be provided to shutdown the processor under catastrophic thermal conditions, as described in
Section 2.4.3
. TDP is a thermal design power specification based on the worst case power
dissipation of the processor while executing publicly available software under normal operating
conditions at nominal voltages. Contact your Intel Field Sales Representative for further
information.
Table 37. Power Specifications for the Mobile Intel Pentium 4 Processor-M
NOTES:
1. TDP is defined as the worst case power dissipated by the processor while executing publicly available
software under normal operating conditions at nominal voltages that meet the load line specifications. The
TDP number shown is a specification based on I
CC
(maximum) at nominal voltages and indirectly tested by
this I
CC
(maximum) testing. TDP definition is synonymous with the Thermal Design Power (typical)
specification. The Intel TDP specification is a recommended design point and is not representative of the
absolute maximum power the processor may dissipate under worst case conditions.
2. Not 100% tested. These power specifications are determined by characterization of the processor currents at
higher temperatures and extrapolating the values for the temperature indicated.
3. The maximum junction temperature (T
J
) is specified as the hottest location on the die. The Thermal Monitor’s
automatic mode is used to indicate that the maximum T
J
has been reached. Refer to
Section 6.1.1
for T
J
measurement guidelines (Refer to
Section 6.1.2
for Thermal Monitor details).
Symbol
Parameter
Min
Typ
Max
Unit
Notes
TDP
Thermal Design Power at
1.8 GHz & 1.3 V
1.7 GHz & 1.3 V
1.6 GHz & 1.3 V
1.5 GHz & 1.3 V
1.4 GHz & 1.3 V
30.0
30.0
30.0
26.9
25.8
W
At 100°C, Note 1
P
AH
P
SGNT
P
SLP
Auto Halt/Stop Grant/Sleep
Power at
1.3 V
1.2 V
7.5
5.9
W
At 50°C, Note 2
P
DSLP
Deep Sleep Power at
1.3 V
1.2 V
5.0
4.2
W
At 35°C, Note 2
P
DPRSLP
Deeper Sleep Power at
1.0 V
2.9
W
At 35°C, Note 2
T
J
Junction Temperature
0
100
°C
Note 3
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