參數(shù)資料
型號: S71GL064A08BFI0F3
廠商: SPANSION LLC
元件分類: 存儲器
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA56
封裝: 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
文件頁數(shù): 11/134頁
文件大?。?/td> 2383K
代理商: S71GL064A08BFI0F3
106
S71GL064A based MCPs
S71GL064A_00_A2 February 8, 2005
Advance
Info rmation
DC Characteristics
(Under Recommended Conditions Unless Otherwise Noted)
Notes:
1. All voltages are referenced to VSS.
2. DC Characteristics are measured after following POWER-UP timing.
3. IOUT depends on the output load conditions.
Parameter
Symbol
Test Conditions
16M
32M
64M
Unit
Min. Max. Min. Max. Min. Max.
Input Leakage
Current
ILI
VIN = VSS to VDD
-1.0 +1.0 -1.0 +1.0 -1.0 +1.0
A
Output Leakage
Current
ILO
VOUT = VSS to VDD, Output Disable
-1.0 +1.0 -1.0 +1.0 -1.0 +1.0
A
Output High
Voltage Level
VOH
VDD = VDD(min), IOH = –0.5mA
2.2
2.4
2.4
V
Output Low
Voltage Level
VOL
IOL = 1mA
0.4
0.4
0.4
V
VDD Power
Down Current
IDDPS
VDD = VDD max.,
VIN = VIH or VIL,
CE2 ≤ 0.2 V
SLEEP
10
10
10
A
IDDP4
4M Partial
N/A
40
N/A
A
IDDP8
8M Partial
N/A
50
80
A
IDDP16
16M Partial
N/A
100
A
VDD Standby
Current
IDDS
VDD = VDD max.,
VIN = VIH or VIL
CE1 = CE2 = VIH
1
1.5
1.5
mA
IDDS1
VDD = VDD max.,
VIN ≤ 0.2V or VIN ≥ VDD – 0.2V,
CE1 = CE2 ≥ VDD – 0.2V
TA<
+85
°C
100
80
170
A
TA<
+40
°C
90
A
VDD
Active Current
IDDA1
VDD = VDD max.,
VIN = VIH or VIL,
CE1 = VIL and CE2= VIH,
IOUT=0mA
tRC / tWC = min. —
20
30
40
mA
IDDA2
tRC / tWC = 1s
3
3
5
mA
VDD Page
Read Current
IDDA3
VDD = VDD max., VIN = VIH or VIL,
CE1 = VIL and CE2= VIH,
IOUT=0mA, tPRC = min.
N/A
10
10
mA
相關(guān)PDF資料
PDF描述
S71GL064A08BFW0B2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08 STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
S71GL064A40BAI0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S71GL064A08BFW0B0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0B2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0B3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0F0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0F2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM