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參數(shù)資料
| 型號： | SAA55XX |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | TV microcontrollers with Closed Captioning (CC) and On-Screen Display (OSD) |
| 中文描述： | 與隱藏字幕（CC）和屏幕顯示（OSD電視微控制器） |
| 文件頁數(shù)： | 2/84頁 |
| 文件大?。?/td> | 352K |
| 代理商： | SAA55XX |
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2000 Feb 23
2
Philips Semiconductors
Preliminary specification
TV microcontrollers with Closed Captioning (CC)
and On-Screen Display (OSD)
SAA55xx
CONTENTS
1
2
3
4
5
6
6.1
6.2
7
7.1
8
8.1
8.2
8.3
8.4
8.5
8.6
9
9.1
9.2
9.3
10
10.1
10.2
10.3
10.4
11
11.1
11.2
11.3
11.4
12
13
13.1
14
14.1
14.2
14.3
14.4
15
FEATURES
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING INFORMATION
Pinning
Pin description
MICROCONTROLLER
Microcontroller features
MEMORY ORGANIZATION
ROM bank switching
RAM organisation
Data memory
SFR memory
Character set feature bits
External (auxiliary) memory
REDUCED POWER MODES
Idle mode
Power-down mode
Standby mode
I/O FACILITY
I/O ports
Port type
Port alternative functions
LED support
INTERRUPT SYSTEM
Interrupt enable structure
Interrupt enable priority
Interrupt vector address
Level/edge interrupt
TIMER/COUNTER
WATCHDOG TIMER
Watchdog Timer operation
PULSE WIDTH MODULATORS
PWM control
Tuning Pulse Width Modulator (TPWM)
TPWM control
Software ADC (SAD)
I
2
C-BUS SERIAL I/O
15.1
16
16.1
16.2
16.3
16.4
17
17.1
18
18.1
18.2
18.3
18.4
18.5
18.6
18.7
18.8
18.9
18.10
18.11
18.12
18.13
18.14
18.15
19
20
21
22
23
24
I
2
C-bus port selection
MEMORY INTERFACE
Memory structure
Memory mapping
Addressing memory
Page clearing
DATA CAPTURE
Data Capture features
DISPLAY
Display features
Display modes
Display feature descriptions
Character and attribute coding
Screen and global controls
Text display controls
Display positioning
Character set
ROM addressing
Redefinable characters
Display synchronization
Video/Data switch (Fast Blanking) polarity
Video/data switch adjustment
RGB brightness control
Contrast reduction
MEMORY MAPPED REGISTERS (MMR)
LIMITING VALUES
CHARACTERISTICS
QUALITY AND RELIABILITY
APPLICATION INFORMATION
ELECTROMAGNETIC COMPATIBILITY
(EMC) GUIDELINES
PACKAGE OUTLINES
SOLDERING
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Manual soldering
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
DEFINITIONS
LIFE SUPPORT APPLICATIONS
PURCHASE OF PHILIPS I
2
C COMPONENTS
25
26
26.1
26.2
26.3
26.4
27
28
29
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