參數(shù)資料
型號: SI3232PPT0-EVB
廠商: Silicon Laboratories Inc
文件頁數(shù): 26/128頁
文件大?。?/td> 0K
描述: BOARD EVAL W/SI3200 INTERFACE
標(biāo)準(zhǔn)包裝: 1
系列: ProSLIC®
主要目的: 接口,模擬前端(AFE)
已用 IC / 零件: Si3232
已供物品: 板,CD
Si3232
Preliminary Rev. 0.96
121
Not
Recommended
fo
r N
ew
D
esi
gn
s
15
ITIPN
I
Negative TIP Current Control
—Connect to the ITIPN lead of the Si3232.
16
ITIPP
I
Positive TIP Current Control
—Connect to the ITIPP lead of the Si3232.
epad
GND
Exposed Die Paddle Ground.
For adequate thermal management, the exposed die paddle should be sol-
dered to a PCB pad that is connected to low-impedance inner and/or back-
side ground planes using multiple vias. See "13. Package Outline: 16-Pin
ESOIC" on page 124 for PCB pad dimensions.
Pin #(s)
Symbol
Input/
Output
Description
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