Si5369
Rev. 1.0
15
Table 6. Thermal Characteristics
(VDD = 1.8 ±5%, 2.5 ±10%, or 3.3 V ±10%, TA = –40 to 85 °C)
Parameter
Symbol
Test Condition
Value
Unit
Thermal Resistance Junction to Ambient
JA
Still Air
31
C°/W
Table 7. Absolute Maximum Ratings*
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
DC Supply Voltage
VDD
–0.5
—
3.8
V
LVCMOS Input Voltage
VDIG
–0.3
—
VDD+0.3
V
CKINn Voltage Level Limits
CKNVIN
0—
VDD
V
XA/XB Voltage Level Limits
XAVIN
0—
1.2
V
Operating Junction Temperature
TJCT
–55
—
150
C
Storage Temperature Range
TSTG
–55
—
150
C
ESD HBM Tolerance
(100 pF, 1.5 k
); All pins except
CKIN+/CKIN–
2—
—
kV
ESD MM Tolerance; All pins
except CKIN+/CKIN–
150
—
V
ESD HBM Tolerance
(100 pF, 1.5 k
); CKIN+/CKIN–
700
—
V
ESD MM Tolerance;
CKIN+/CKIN–
100
—
V
Latch-up Tolerance
JESD78 Compliant
*Note: Permanent device damage may occur if the Absolute Maximum Ratings are exceeded. Functional operation should be
restricted to the conditions as specified in the operation sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods of time may affect device reliability.