參數(shù)資料
型號(hào): SL2ICS5001EW/V7,00
廠商: NXP Semiconductors
文件頁(yè)數(shù): 17/28頁(yè)
文件大小: 0K
描述: IC I-CODE SLI SMART LABEL DIE
標(biāo)準(zhǔn)包裝: 31,071
系列: *
136430
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 3.0 — 14 March 2007
24 of 28
NXP Semiconductors
SL2 ICS50/SL2 ICS51
ICODE SLI-L/ICODE SLI-L HC
PUBLIC
8.4 Data integrity
Following mechanisms are implemented in the contactless communication link between
interrogator and label to ensure very reliable data transmission:
16-bit CRC per block
Bit count checking
Bit coding to distinguish between “1”, “0” and no information
Channel monitoring (protocol sequence and bit stream analysis)
8.5 RF interface
The definition of the RF interface is according to the standard ISO/IEC 15693-2 and
ISO/IEC 15693-3.
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參數(shù)描述
SL2ICS5101EW/V7,00 功能描述:數(shù)據(jù)轉(zhuǎn)換系統(tǒng) Dedicated Chip For Smart Lapel APPS RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換速率:0.001 MSPs 分辨率:24 bit 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
SL2ICS5101EW/V7,005 制造商:NXP Semiconductors 功能描述:
SL2ICS5301EW/V7,00 功能描述:數(shù)據(jù)轉(zhuǎn)換系統(tǒng) Wafer addendum RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換速率:0.001 MSPs 分辨率:24 bit 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
SL2ICS5301EW/V7L,005 制造商:NXP Semiconductors 功能描述:
SL2ICS5311EW/V7,00 功能描述:數(shù)據(jù)轉(zhuǎn)換系統(tǒng) Bumped Wafer RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換速率:0.001 MSPs 分辨率:24 bit 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel