參數(shù)資料
型號(hào): SL2ICS5001EW/V7,00
廠商: NXP Semiconductors
文件頁(yè)數(shù): 24/28頁(yè)
文件大?。?/td> 0K
描述: IC I-CODE SLI SMART LABEL DIE
標(biāo)準(zhǔn)包裝: 31,071
系列: *
136430
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 3.0 — 14 March 2007
5 of 28
NXP Semiconductors
SL2 ICS50/SL2 ICS51
ICODE SLI-L/ICODE SLI-L HC
PUBLIC
6. Block diagram
The SL2 ICS50/SL2 ICS51 IC consists of three major blocks:
Analog RF Interface
Digital Controller
EEPROM
The analog part provides stable supply voltage and demodulates data received from the
reader for being processed by the digital part. Further, the modulation transistor of the
analog part transmits data back to the reader.
The digital section includes the state machines, processes the protocol and handles
communication with the EEPROM.
Fig 1. Block diagram of TAG IC
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SL2ICS5101EW/V7,00 功能描述:數(shù)據(jù)轉(zhuǎn)換系統(tǒng) Dedicated Chip For Smart Lapel APPS RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換速率:0.001 MSPs 分辨率:24 bit 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
SL2ICS5101EW/V7,005 制造商:NXP Semiconductors 功能描述:
SL2ICS5301EW/V7,00 功能描述:數(shù)據(jù)轉(zhuǎn)換系統(tǒng) Wafer addendum RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換速率:0.001 MSPs 分辨率:24 bit 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
SL2ICS5301EW/V7L,005 制造商:NXP Semiconductors 功能描述:
SL2ICS5311EW/V7,00 功能描述:數(shù)據(jù)轉(zhuǎn)換系統(tǒng) Bumped Wafer RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換速率:0.001 MSPs 分辨率:24 bit 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel