參數(shù)資料
型號(hào): TLV320AIC3111IRHBR
廠商: TEXAS INSTRUMENTS INC
元件分類: 音頻/視頻放大
英文描述: AUDIO AMPLIFIER, PQCC32
封裝: 5 X 5 MM, GREEN, PLASTIC, QFN-32
文件頁(yè)數(shù): 102/156頁(yè)
文件大?。?/td> 1701K
代理商: TLV320AIC3111IRHBR
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www.ti.com
SLAS644B – JULY 2009 – REVISED OCTOBER 2009
TERMINAL FUNCTIONS (continued)
TERMINAL
I/O
DESCRIPTION
NAME
NO.
RESET
31
I
Device reset
SCL
10
I/O
I2C control bus clock input
SDA
9
I/O
I2C control bus data input
SPLM
19
O
Left-channel class-D speaker driver inverting output
SPLP
22
O
Left-channel class-D speaker driver noninverting output
SPLVDD
21
Left-channel class-D speaker driver power supply
SPLVSS
20
Left-channel class-D speaker driver power supply ground
SPRM
23
O
Right-channel class-D speaker driver inverting output
SPRP
26
O
Right-channel class-D speaker driver noninverting output
SPRVDD
24
Right-channel class-D speaker driver power supply
SPRVSS
25
Right-channel class-D speaker driver power supply ground
VOL/MICDET
11
I
Volume control or microphone detection
WCLK
6
I/O
Audio serial word clock
3
ELECTRICAL SPECIFICATIONS
3.1
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
AVDD to AVSS
–0.3 to 3.9
V
DVDD to DVSS
–0.3 to 2.5
V
HPVDD to HPVSS
–0.3 to 3.9
V
SPLVDD to SPLVSS
–0.3 to 6
V
SPRVDD to SPRVSS
–0.3 to 6
V
IOVDD to IOVSS
–0.3 to 3.9
V
Digital input voltage
IOVSS – 0.3 to IOVDD + 0.3
V
Analog input voltage
AVSS – 0.3 to AVDD + 0.3
V
Operating temperature range
–40 to 85
°C
Storage temperature range
–55 to 150
°C
Junction temperature (TJ Max)
105
°C
Power dissipation
(TJ Max – TA)/RθJA
W
QFN package
RθJA thermal impedance (with thermal pad soldered to board)
35
°C/W
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
3.2
THERMAL CHARACTERISTICS
This data was taken using 2-oz. (0.071-mm thick) trace and copper pad that is soldered to a JEDEC high-K, standard 4-layer
3-in. × 3-in. (7.62-cm × 7.62-cm) PCB.
Power Rating at 25°C
Derating Factor
Power Rating at 70°C
Power Rating at 85°C
2.3 W
28.57 mW/°C
1 W
0.6 W
Copyright 2009, Texas Instruments Incorporated
ELECTRICAL SPECIFICATIONS
5
Product Folder Link(s): TLV320AIC3111
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