參數(shù)資料
型號： TMS320C6415TGLZ7
廠商： Texas Instruments
文件頁數(shù)： 118/146頁
文件大?。?/td> 0K
描述： IC DSP FIXED-POINT 532-FCBGA
標準包裝： 60
系列： TMS320C6414T/15T/16T
類型： 定點
接口： 主機接口，McBSP，PCI，UTOPIA
時鐘速率： 720MHz
非易失內存： 外部
芯片上RAM： 1.03MB
電壓 - 輸入/輸出： 3.30V
電壓 - 核心： 1.20V
工作溫度： 0°C ~ 90°C
安裝類型： 表面貼裝
封裝/外殼： 532-BFBGA，F(xiàn)CBGA
供應商設備封裝： 532-FCBGA（23x23）
包裝： 托盤
配用： TMDXEVM6452-ND - TMDXEVM6452
296-23038-ND - DSP STARTER KIT FOR TMS320C6416
其它名稱： 296-17756
TMS320C6414T, TMS320C6415T, TMS320C6416T
FIXEDPOINT DIGITAL SIGNAL PROCESSORS
SPRS226M NOVEMBER 2003 REVISED APRIL 2009
73
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
DVDD
CVDD
VSS
C6000
DSP
Schottky
Diode
I/O Supply
Core Supply
GND
Figure 11. Schottky Diode Diagram
Core and I/O supply voltage regulators should be located close to the DSP (or DSP array) to minimize
inductance and resistance in the power delivery path. Additionally, when designing for high-performance
applications utilizing the C6000
platform of DSPs, the PC board should include separate power planes for
core, I/O, and ground, all bypassed with high-quality low-ESL/ESR capacitors.
power-supply decoupling
In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as possible
close to the DSP. Assuming 0603 caps, the user should be able to fit a total of 60 caps, 30 for the core supply
and 30 for the I/O supply. These caps need to be close to the DSP power pins, no more than 1.25 cm maximum
distance to be effective. Physically smaller caps, such as 0402, are better because of their lower parasitic
inductance. Proper capacitance values are also important. Small bypass caps (near 560 pF) should be closest
to the power pins. Medium bypass caps (220 nF or as large as can be obtained in a small package) should be
next closest. TI recommends no less than 8 small and 8 medium caps per supply (32 total) be placed
immediately next to the BGA vias, using the “interior” BGA space and at least the corners of the “exterior”.
Eight larger caps (4 for each supply) can be placed further away for bulk decoupling. Large bulk caps (on the
order of 100
F) should be furthest away (but still as close as possible). No less than 4 large caps per supply
(8 total) should be placed outside of the BGA.
Any cap selection needs to be evaluated from a yield/manufacturing point-of-view. As with the selection of any
component, verification of capacitor availability over the product’s production lifetime should be considered.
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