參數(shù)資料
型號(hào)： TMS320DM355_07
廠商： Texas Instruments, Inc.
英文描述： Digital Media System-on-Chip (DMSoC)
中文描述： 數(shù)字媒體系統(tǒng)芯片（DMSoC）
文件頁數(shù)： 97/158頁
文件大?。?/td> 1319K
代理商： TMS320DM355_07
www.ti.com
P
5.3.1
Power-Supply Sequencing
TMS320DM355
Digital Media System-on-Chip (DMSoC)
SPRS463B–SEPTEMBER 2007–REVISED OCTOBER 2007
In order to ensure device reliability, the DM355 requires the following power supply power-on and
power-off sequences. See table
Table 5-1
for a description of DM355 power supplies.
Power-On:
1. Power on 1.3 V: CV
DD
, V
DDA_PLL1/2
, V
DDD13_USB
, V
DDA13_USB
2. Power on 1.8 V: V
DD_DDR
, V
DDA18_DAC
3. Power on 3.3 V: D
VDD
, V
DDA33_DDRDLL
, V
DDA33_USB
, V
DDA33_USB_PLL
, V
DD_VIN
, V
DD_VOUT
You may power-on the 1.8 V and 3.3 V power supplies simultaneously.
Power-Off:
1. Power off 3.3 V: D
VDD
, V
DDA33_DDRDLL
, V
DDA33_USB
, V
DDA33_USB_PLL
, V
DD_VIN
, V
DD_VOUT
2. Power off 1.8 V: V
DD_DDR
, V
DDA18_DAC
3. Power off 1.3 V: CV
DD
, V
DDA_PLL1/2
, V
DDD13_USB
, V
DDA13_USB
You may power-off the 1.8 V and 3.3 V power supplies simultaneously.
Note that when booting the DM355 from OneNAND, you must ensure that the OneNAND device is ready
with valid program instructions before the DM355 attempts to read program instructions from it. In
particular, before you release DM355 reset, you must allow time for OneNAND device power to stabilize
and for the OneNAND device to complete its internal copy routine. During the internal copy routine, the
OneNAND device copies boot code from its internal non-volatile memory to its internal boot memory
section. Board designers typically achieve this requirement by design of the system power and reset
supervisor circuit. Refer to your OneNAND device datasheet for OneNAND power ramp and stabilization
times and for OneNAND boot copy times.
5.3.1.1
Power-Supply Design Considerations
Core and I/O supply voltage regulators should be located close to the DM355 to minimize inductance and
resistance in the power delivery path. Additionally, when designing for high-performance applications
utilizing the DM355 device, the PC board should include separate power planes for core, I/O, and ground,
all bypassed with high-quality low-ESL/ESR capacitors.
5.3.1.2
Power-Supply Decoupling
In order to properly decouple the supply planes from system noise, place as many capacitors (caps) as
possible close to DM355. These caps need to be close to the DM355 power pins, no more than 1.25 cm
maximum distance to be effective. Physically smaller caps, such as 0402, are better because of their
lower parasitic inductance. Proper capacitance values are also important. Small bypass caps (near 560
pF) should be closest to the power pins. Medium bypass caps (220 nF or as large as can be obtained in a
small package) should be next closest. TI recommends no less than 8 small and 8 medium caps per
supply be placed immediately next to the BGA vias, using the "interior" BGA space and at least the
corners of the "exterior".
Larger caps for each supply can be placed further away for bulk decoupling. Large bulk caps (on the order
of 100
μ
F) should be furthest away, but still as close as possible. Large caps for each supply should be
placed outside of the BGA footprint.
Any cap selection needs to be evaluated from a yield/manufacturing point-of-view. As with the selection of
any component, verification of capacitor availability over the product’s production lifetime should be
considered. See also
Section 5.5.1
and
Section 5.5.2
for additional recommendations on power supplies
for the oscillator/PLL supplies.
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DM355 Peripheral Information and Electrical Specifications
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