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參數(shù)資料
| 型號： | TPS2345PWNRND |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 電源管理 |
| 英文描述： | 4-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO24 |
| 封裝： | GREEN, TSSOP-24 |
| 文件頁數(shù)： | 20/32頁 |
| 文件大小： | 621K |
| 代理商： | TPS2345PWNRND |
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TPS2345
SLUS503B – MARCH 2002 – REVISED AUGUST 2002
27
www.ti.com
APPLICATION INFORMATION
protecting the TPS2345 from voltage transients
Parasitic inductance associated with the power distribution network can cause large voltage spikes on the
supply rails if the current is suddenly interrupted by the TPS2345 during a fault condition. It is important to protect
the TPS2345 against such spikes to avoid device damage. There are several practices that provide sufficient
protection.
D Clamp the voltage at the supply pins of the TPS2345 with Zener diodes. Since the absolute maximum
voltage rating of the device is 15 V, this is most important on the 12-V and –12-V rails. The typical application
diagram shows the connection of these devices (D1 and D2) in the circuit. The diodes should be placed
close to the TPS2345, with short trace lengths back to the VINx and GND pins. The maximum breakdown
of these devices must be less than 15 V to properly protect the TPS2345. Lower voltage Zeners can also
be placed on the 5-V and 3.3-V pins if desired, but the steady-state operating level of these pins provides
more margin from damage levels. In addition, it may be necessary to protect the sense inputs on the 12-V
and –12-V back-end planes, VS1 and VS4, depending on the PCB characteristics.
D Use dedicated PCB planes for the four supplies and ground nodes and maximize the trace width of
high-current runs to minimize inductance associated with the power distribution. This is recommended on
both the backplane and plug-in modules.
layout considerations
To optimize the performance of the TPS2345, care should be taken to use good layout practice with the parts
placement and etch routing of the hot swap circuit components. This includes any protection devices as well
as the sense and pass elements. Protection devices should be located close to the hot swap controller, and
trace-lengths back to their respective pins kept to a minimum. If a decoupling capacitor is used on the VIN1
supply, it also should be placed close to the part.
Mount the charge pump reservoir capacitor (C6 in the application diagram) close to the TPS2345, with minimal
trace lengths back to the CPUMP and CPGND pins.
For proper operation, the three ground pins of the TPS2345 must be connected together near the device. The
ground leads of the ramp and charge pump capacitors, protection diodes, and any decoupling capacitors should
also tie into this node close to the part. This junction should be routed separately back to the J1 connector, where
it can tie into the PCB GND node, as opposed to tying into the ground plane elsewhere in the high-current return
path.
Use wide traces when connecting the sense resistors and power FETs into their respective current paths. When
feeding these connections through from an internal power plane, use multiple vias to reduce the overall
impedance of the current path. This helps reduce insertion loss across the hot swap interface, and improve the
thermal performance of the PCB. Additional copper plane used on the land patterns of these devices can
significantly reduce their thermal impedance, reducing temperature rise in the module and improving overall
reliability of the power devices.
Connections to the sense resistors for the VINx and CSx device pins should be made with good Kelvin
connections to optimize the accuracy of the current-limit thresholds and slew-rate control. This is especially
important for the 5-V and 3.3-V sense connections. Because typical load levels on these supplies are so high,
up to 10 A, board trace resistance between elements in the supply current paths becomes significant. The two
sense traces for each supply should connect symmetrically to the sense resistor land pattern, in close proximity
to the element leads, and not upstream or downstream from the device. Trace routing back to the TPS2345
should be fairly well balanced. Figure 22 illustrates two recommendations for the current sense layout.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| TPS2345PWR | 制造商:Rochester Electronics LLC 功能描述:COMPACTPCI HOT SWAP POWER MANAGER - Bulk |
| TPS2346PW | 功能描述:IC HOT SWAP POWER MGR 24-TSSOP RoHS:是 類別:集成電路 (IC) >> PMIC - 熱交換 系列:- 產(chǎn)品培訓(xùn)模塊:Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:100 系列:- 類型:熱插拔開關(guān) 應(yīng)用:通用 內(nèi)部開關(guān):是 電流限制:可調(diào) 電源電壓:9 V ~ 13.2 V 工作溫度:-40°C ~ 150°C 安裝類型:表面貼裝 封裝/外殼:10-WFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:10-TDFN-EP（3x3） 包裝:管件 |
| TPS2346PWR | 功能描述:熱插拔功率分布 Optical Network Hot Swap Controller RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| TPS2346PWRG4 | 功能描述:熱插拔功率分布 Optical Network Hot Swap Controller RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| TPS2350D | 功能描述:熱插拔功率分布 Pwr Mngr for Redund -48V Supplies RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
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