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參數(shù)資料
| 型號(hào)： | TS(X)PC603EMAU3LL |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 100 MHz, RISC PROCESSOR, CQFP240 |
| 封裝： | CERAMIC, QFP-240 |
| 文件頁數(shù)： | 4/38頁 |
| 文件大?。?/td> | 632K |
| 代理商： | TS(X)PC603EMAU3LL |
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TSPC603E
12/38
Parameter
Symbol
Min
Max
Unit
Core supply voltage
VDD
3.135
3.465
V
PLL supply voltage
AVDD
3.135
3.465
V
I/O supply voltage
OVDD
3.135
3.465
V
Input voltage
Vin
GND
5.5
V
Operating temperature
Tc
-55
+125
°C
3.5. Thermal characteristics
3.5.1.CQFP240 package
This section provides thermal management data for the 603e ; this information is based on a typical desktop configuration using a 240
lead, 32 mm x 32 mm, wire-bond CQFP package. The heat sink used for this data is a pinfin configuration from Thermalloy, part
number 2338.
3.5.1.1. Thermal characteristics
The thermal characteristics for a wire-bond CQFP package are as follows :
Thermal resistance (junction-to-case) (typical)= Rqjc or qjc = 2.2°C/Watt.
Wire–bond CQFP die junction–to–lead thermal resistance (typical) =
θ JB = 18 °C/W
3.5.1.2. Thermal management example
The following example is based on a typical desktop configuration using a wire-bond CQFP package. The heat sink used for this data
is a pinfin heat sink #2338 attached to the wire-bond CQFP package with thermal grease.
Figure 5 provides a thermal management example for the CQFP package.
0
5
10
15
20
25
30
35
012
345
Junction-to-Ambient
thermal
Resistance
(degreeC/Watt)
Forced convection (m/sec)
Motorola Wire-Bond CQFP
With Heat Sink
Figure 5 : CQFP thermal management example
The junction temperature can be calculated from the junction to ambient thermal resistance, as follows :
Junction temperature :
Tj = Ta + Rqja * P
or
Tj = Ta + (Rqjc + Rcs + Rsa) * P
Where :
Ta is the ambient temperature in the vicinity of the device
Rqja is the junction-to-ambient thermal resistance
Rqjc is the junction-to-case thermal resistance of the device
Rcs is the case-to-heat sink thermal resistance of the interface material
Rsa is the heat sink-to-ambient thermal resistance
P is the power dissipated by the device
In this environment, it can be assumed that all the heat is dissipated to the ambient through the heat sink, so the junction-to-ambient
thermal resistance is the sum of the resistances from the junction to the case, from the case to the heat sink, and from the heat sink to
the ambient.
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