參數(shù)資料
型號: TSC87251G2D-L16CED
廠商: ATMEL CORP
元件分類: 微控制器/微處理器
英文描述: B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES
中文描述: 16-BIT, OTPROM, 16 MHz, MICROCONTROLLER, PQFP44
封裝: 10 X 10 MM, PLASTIC, VQFP-44
文件頁數(shù): 12/28頁
文件大?。?/td> 153K
代理商: TSC87251G2D-L16CED
Qualpack TSC87251G2D
12 Rev 0 – October 1999
3.2 Qualification Flow
General Requirements for Plastic packaged CMOS IC
Standard
Test Description
Qualification type
(acceptance)
MIL-STD 883D
Method 1005
Electrical Life Test (Early Failure Rate)
12 hours 150°C (Tj) 5.75V
Device
(1/2000 12h)
MIL-STD 883D
Method 1005
Electrical Life Test (Latent Failure Rate)
1000 hours 150°C 5.75V Dynamic or Static
Device
(0/100 500h)
MIL-STD 883D
Method 3015.7
Electrostatic Discharge HBM
+/-2000v 1.5kOhm/100pF/3 pulses
Device
(0/3 per level)
JEDEC 78
Latch up
50mW power injection 125°C
Device
(0/10)
MHS
PAQA0046
NV Memory Dataretention
High Temperature Storage 165°C
Device
(0/50 500c)
MIL-STD 883D
Method 1010
Temperature Cycling
1000 cycles -65°C/150°C air/air
Die and Package
(0/50 500c)
MHS
PAQA0184
Pressure Pot after Mounting Stress
168 hours 130°C/85%RH
Die and Package
(0/50 168h)
EIA
JESD22-A101
85/85 Humidity Test
1000 hours 85°C/85%RH
Die and Package
(0/50 500h)
EIA
JESD22-A110
HAST
336 hours 130°C/85%RH/5.5V
Die and Package
(0/50 168h)
EIA
JEDEC J-20-STD
Moisture Sensitivity Ranking
Infra Red Stress 220°C/235°c/3 times
Package
(0/10 per class)
MIL-STD 883D
Method 2003
Solderability
Package
(0/3)
MIL-STD 883D
Method 2015
Marking Permanency
Package
(0/5)
相關(guān)PDF資料
PDF描述
TSC87251G2D-L16CB B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES
TSC83251G2D-L16CB B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES
TSC83251G2D-L16CED B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES
TSC87251G2D B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES
TSC87251G2D-16CB B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES
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