參數(shù)資料
型號： TSC87251G2D-L16CED
廠商： ATMEL CORP
元件分類： 微控制器/微處理器
英文描述： B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES
中文描述： 16-BIT, OTPROM, 16 MHz, MICROCONTROLLER, PQFP44
封裝： 10 X 10 MM, PLASTIC, VQFP-44
文件頁數(shù)： 24/28頁
文件大小： 153K
代理商： TSC87251G2D-L16CED
Qualpack TSC87251G2D
24 Rev 0 – October 1999
4. User Information
4.1 Soldering Recommendations
For DRY PACKED products,
TEMIC recommends to strictly follow the procedure described
hereunder:
- Dry packed products must not be stored more than 1 year at 40°c - 90%rh
(worst storage conditions assumed)
- A longer storage period is allowed taking into account the following conditions:
5 years max at 25°c (+/-5°c) - 50%rh
- From opening of the packs, the product must be assembled within 48 hours.
(worst in-process storage condition assumed: 30°c - 60%rh)
- If they cannot be soldered within this time period, then the pieces must be dryed at
125°c for 24 hours. Only one drying is allowed.
- Max relative humidity allowed in the bag is 20% (readable on the indicator inside
the bag). If this value is reached, then the parts must be dryed at 125°C for
24 hours before mounting.
- For high sensitive products, the delay between pack openning and assembly is
reduced to 6 hours (Level 6 of JEDEC 22-A112). In this case, a warning printed on
each pack advises the user of this restriction.
4.2 DRY PACK Ordering rules
TEMIC qualification procedure allows to classify products according to JEDEC 22-A112 and to
determine the convenient conditioning for safe customer use.
Nevertheless, even if the product is not classified as moisture sensitive, it is possible (for example if
storage conditions are not properly controlled) to order product with a Dry Pack.
4.3 ESD caution
The user must protect components against EOS and ESD damages by grounding personal and
workstations.
相關(guān)PDF資料
PDF描述
TSC87251G2D-L16CB B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES
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TSC87251G2D B/16-BIT MICROCONTROLLER WITH SERIAL COMMUNICATION INTERFACES
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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TSC873CW RPG 功能描述:兩極晶體管 - BJT NPN Silicon Planar Med Power Transistor RoHS:否 制造商:STMicroelectronics 配置: 晶體管極性:PNP 集電極—基極電壓 VCBO: 集電極—發(fā)射極最大電壓 VCEO:- 40 V 發(fā)射極 - 基極電壓 VEBO:- 6 V 集電極—射極飽和電壓: 最大直流電集電極電流: 增益帶寬產(chǎn)品fT: 直流集電極/Base Gain hfe Min:100 A 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PowerFLAT 2 x 2
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TSC888BILT 功能描述:電流靈敏放大器 Sense Amplifier 50 Gain RoHS:否 制造商:Texas Instruments 通道數(shù)量: 共模抑制比（最小值）:110 dB 輸入補(bǔ)償電壓:80 uV 電源電壓-最大:5.5 V 電源電壓-最小:2.7 V 電源電流:350 uA 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VQFN-16 封裝:Reel
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