參數(shù)資料
型號： UPD30550F2-300-NN1
廠商： NEC Corp.
英文描述： VR5500⑩ 64-/32-BIT MICROPROCESSOR
中文描述： VR5500⑩64-/32-BIT微處理器
文件頁數(shù)： 25/27頁
文件大小： 569K
代理商： UPD30550F2-300-NN1
Data Sheet U15700EJ1V0DS
25
μ
PD30550
4. RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For details on the recommended soldering conditions, refer to the
Semiconductor Device Mounting Technology
Manual (C10535E)
.
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 4-1. Surface mounting Type Soldering Conditions
μ
PD30550F2-300-NN1: 272-pin plastic BGA (C/D advanced type) (29
×
29)
μ
PD30550F2-400-NN1: 272-pin plastic BGA (C/D advanced type) (29
×
29)
Soldering Method
Soldering Conditions
Recommended Condition
Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max.
(at 210
°
C or higher), Count: Three times or less, Exposure
limit: 3 days
Note
(after that, prebake at 125
°
C for 10 hours)
IR35-103-3
Note
After opening the dry pack, store it at 25
°
C or less and 65% RH or less for the allowable storage period.
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UPD30550F2-400-NN1 制造商:NEC 制造商全稱:NEC 功能描述:VR5500⑩ 64-/32-BIT MICROPROCESSOR
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