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參數(shù)資料
| 型號(hào)： | UPD75336GK |
| 廠商： | NEC Corp. |
| 英文描述： | 4-BIT SINGLE-CHIP MICROCOMPUTER |
| 中文描述： | 4位單片機(jī) |
| 文件頁數(shù)： | 62/68頁 |
| 文件大小： | 532K |
| 代理商： | UPD75336GK |
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62
μ
PD75336
12. RECOMMENDED SOLDERING CONDITIONS
The
μ
PD75336 should be soldered and mounted under the conditions recommended in the table below.
For detail of recommended soldering conditions, refer to information document
“Surface Mount Technology
Manual” (IEI-1207)
.
For soldering methods and conditions other than those recommended below, contact our salesman.
Table 12-1 Surface Mounting Type Soldering Conditions
(1)
μ
PD75336GC-
×××
-3B9 : 80-pin plastic QFP ( 14mm)
Soldering Conditions
Package peak temperature: 230C,
Duration: 30 sec. max. (at 210C above), Number of times: Once,
Time limit: 7 days
*
(thereafter 10 hours prebaking required at 125C)
Package peak temperature: 215C,
Duration: 40 sec. max. (at 200C above), Number of times: Once,
Time limit: 7 days
*
(thereafter 10 hours prebaking required at 125C)
Solder bath temperature: 260C max.,
Duration: 10 sec. max., Number of times: Once,
Preliminary heat temperature: 120C max. (Package surface temperature),
Time limit: 7 days
*
(thereafter 10 hours prebaking required at 125C)
Pin part temperature: 300C max., Duration: 3 sec. max. (per device side)
Soldering Method
Infrared reflow
VPS
Wave soldering
Pin part heating
Recommended
Condition Symbol
IR30-107-1
VP15-107-1
WS60-107-1
(2)
μ
PD75336GK-
×××
-BE9 : 80-pin plastic TQFP (fine pitch)( 12mm)
Soldering Conditions
Package peak temperature: 230C,
Duration: 30 sec. max. (at 210C above), Number of times: Once,
Time limit: 1 days
*
(thereafter 16 hours prebaking required at 125C)
Package peak temperature: 215C,
Duration: 40 sec. max. (at 200C above), Number of times: Once,
Time limit: 1 days
*
(thereafter 16 hours prebaking required at 125C)
Pin part temperature: 300C max., Duration: 3 sec. max. (per device side)
Soldering Method
Infrared reflow
VPS
Pin part heating
Recommended
Condition Symbol
IR30-161-1
VP15-161-1
*
For the storage period after dry-pack decompression, storage conditions are max. 25
°
C, 65% RH.
Note
Use of more than one soldering method should be avoided (except in the case of pin part heating).
Notice
A version of this product with improved recommended soldering conditions is available.
For details (improvements such as infrared reflow peak temperature extension (235C), number of times:
twice, relaxation of time limit, etc.), contact NEC sales personnel.
#
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