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參數(shù)資料
| 型號： | VSC6511RC |
| 廠商： | VITESSE SEMICONDUCTOR CORP |
| 元件分類： | 通信及網(wǎng)絡(luò) |
| 英文描述： | Rotary Switch; Contact Current Max:1.5A; No. of Poles:2; No. of Switch Positions:11; Indexing:30 ; No. of Decks:2; Switch Terminals:Solder Lug; Circuitry:SPDT; Mounting Type:Panel; Switch Features:30 degrees Indexing RoHS Compliant: Yes |
| 中文描述： | SPECIALTY TELECOM CIRCUIT, PQFP64 |
| 封裝： | 10 X 10 MM,1 MM HEIGHT, EXPOSED PAD, TQFP-64 |
| 文件頁數(shù)： | 18/22頁 |
| 文件大?。?/td> | 379K |
| 代理商： | VSC6511RC |
VITESSE
Advance Product Information
Deserializer/Reclocker at 1.485Gb/s
SMPTE-292M Serializer, Deserializer, and
VSC6511
Page 18
VITESSE
SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 805/388-3700 FAX: 805/987-5896
4/10/00
G52311-0, Rev 2.0
D
Package Thermal Characteristics
The VSC6511 is packaged in an exposed pad, thin quad flat pack (TQFP) which adheres to industry stan-
dard EIAJ footprints for a 10x10x1.0mm body, 64 lead TQFP. The package construction is shown below. The
bottom of the lead frame is exposed so that it can be soldered to the printed circuit board and connected to the
ground plane. This provides excellent thermal characteristics and reduces electrical parasitics as well.
Figure 11: Package Cross Section
Table 10: 64-pin, Exposed Pad TQFP Thermal Resistance
The VSC6511 is designed to operate with a case temperature up to 95
o
C. The user must guarantee that the
case temperature specification is not violated. With the thermal resistances shown above, the VS6511 can oper-
ate in still air ambient temperatures of 70
o
C [~70
o
C = 95
o
C - 0.8W * 30]. If the ambient air temperature exceeds
these limits then some form of cooling through a heatsink or an increase in airflow must be provided. Additional
heat can be transferred to the printed circuit board by not using thermal reliefs on the power and ground plane
vias as well as using multiple vias to the power and ground planes.
If the exposed pad is not soldered to the printed circuit board and grounded, both thermal and electrical per-
formance will be degraded significantly.
Moisture Sensitivity Level
This device is rated with a Moisture Sensitivity Level 3 rating. Refer to Application Note AN-20 for
appropriate handling procedures.
Symbol
Description
Value
Units
θ
ca-0
θ
ca-100
θ
ca-200
θ
ca-400
θ
ca-600
Thermal resistance from case to ambient, still air
Thermal resistance from case to ambient, 100 LFPM air
Thermal resistance from case to ambient, 200 LFPM air
Thermal resistance from case to ambient, 400 LFPM air
Thermal resistance from case to ambient, 600 LFPM air
30
o
C/W
o
C/W
o
C/W
o
C/W
o
C/W
25
23
21
20
Die
Plastic Molding Compound
Wire Bond
Ground Bond
Die Attach Epoxy
Copper Lead Frame
Exposed Pad
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