參數資料
型號: W3E16M64S-250BC
廠商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分類: DRAM
英文描述: 16M X 64 DDR DRAM, 0.8 ns, PBGA219
封裝: 21 X 25 MM, PLASTIC, BGA-219
文件頁數: 8/16頁
文件大?。?/td> 406K
代理商: W3E16M64S-250BC
16
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W3E16M64S-XBX
January 2008
Rev. 5
Document Title
16M x 64 DDR SDRAM Multi-Chip Package
Revision History
Rev # History
Release Date Status
Rev 0
Initial Release
December 2002
Advanced
Rev 1
Changes (Pg. 1, 15, 16)
Package dimension changes
1.1 Ball diameter to 0.76 +/-0.08
1.2 Package size to 25x21mm Max
1.3 Package height to 2.65mm Max
1.4 Add solder ball coplanarity of 0.2mm
May 2003
Advanced
Rev 2
Changes (Pg. 1, 15, 16)
2.1 Change mechanical drawing to new style
2.2 Change status to preliminary
November 2003
Preliminary
Rev 3
Changes (Pg. 1, 10, 11, 12, 13, 15, 16)
3.1 Change status to Final
3.2 Correct typographical errors
September 2004
Final
Rev 4
Changes (Pg. 1, 11, 16)
4.1 Changes IOH, IOL to 12mA minimum
4.2 Update ICC Specications table values
February 2005
Final
Rev 5
Changes (Pg. 1, 12, 16)
5.1 Correct typo on pinout, ball L12, remove “#”
January 2007
Final
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W3E16M72S-266BI 16M X 72 DDR DRAM, 0.75 ns, PBGA219
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相關代理商/技術參數
參數描述
W3E16M64S-250BI 制造商:Microsemi Corporation 功能描述:16M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk
W3E16M64S-250BM 制造商:Microsemi Corporation 功能描述:16M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, MIL-TEMP. - Bulk
W3E16M64S-266BC 制造商:Microsemi Corporation 功能描述:16M X 64 DDR, 2.5V, 266 MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk
W3E16M64S-266BI 制造商:Microsemi Corporation 功能描述:16M X 64 DDR, 2.5V, 266 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk
W3E16M64S-266BM 制造商:Microsemi Corporation 功能描述:16M X 64 DDR, 2.5V, 266 MHZ, 219 PBGA, MIL-TEMP. - Bulk