參數(shù)資料
型號: W987X6CBG80
廠商: WINBOND ELECTRONICS CORP
元件分類: DRAM
英文描述: 8M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54
封裝: 8 X 9 MM, 1.20 MM HEIGHT, FBGA-54
文件頁數(shù): 36/46頁
文件大?。?/td> 1634K
代理商: W987X6CBG80
Preliminary W987X6CB
Publication Release Date: June 6, 2002
- 41 -
Revision A1
Operating Timing Example, continued
Timing Chart of Burst Stop Cycle (Burst Stop Command)
Read
BST
0
11
10
9
8
7
6
5
4
3
2
1
DQ
Q0
Q1
Q2
Q3
BST
( a ) CAS latency =2
Command
( b )CAS latency = 3
(1) Read cycle
Q4
(2) Write cycle
Command
Read
Command
Q0
Q1
Q2
Q3
Q4
Q0
Q1
Q2
Q3
Q4
DQ
Write
BST
Note:
represents the Burst stop command
BST
Timing Chart of Burst Stop Cycle (Precharge Command)
In the case of Burst Lenght = 8
Read
PRCG
0
11
10
9
8
7
6
5
4
3
2
1
Q0
Q1
Q2
Q3
Q0
Q1
Q2
Q3
Read
PRCG
Q4
( a )CAS latency =2
Command
( b )CAS latency = 3
Command
DQ
DQ
DQ
( b )CAS latency = 3
Command
(1) Read cycle
(2) Write cycle
Write
PRCG
( a ) CAS latency =2
Command
DQM
tWR
D0
D1
D2
D3
D4
DQ
D0
D1
D2
D3
D4
DQ
相關PDF資料
PDF描述
WF512K32-90G1TI5A 512K X 32 FLASH 5V PROM MODULE, 90 ns, CQFP68
WF512K32-90G1TI5 512K X 32 FLASH 5V PROM MODULE, 90 ns, CQFP68
WS128K32-70G4I 512K X 8 MULTI DEVICE SRAM MODULE, 70 ns, CQFP68
WS128K32-85G4I 512K X 8 MULTI DEVICE SRAM MODULE, 85 ns, CQFP68
WS128K32-85HM 512K X 8 MULTI DEVICE SRAM MODULE, 85 ns, CHIP66
相關代理商/技術參數(shù)
參數(shù)描述
W987Y6CBN 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DRAM
W987Z6CBN 制造商:未知廠家 制造商全稱:未知廠家 功能描述:DRAM
W988D2FB 制造商:WINBOND 制造商全稱:Winbond 功能描述:256Mb Mobile LPSDR
W988D2FBJX6E 制造商:Winbond Electronics Corp 功能描述:IC LPSDR SDRAM 256MBIT 90VFBGA
W988D2FBJX6I 制造商:WINBOND 制造商全稱:Winbond 功能描述:256Mb Mobile LPSDR