XC18V00 Series In-System-Programmable Configuration PROMs
DS026 (v5.2) January 11, 2008
Product Specification
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Notice of Disclaimer
THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND
WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE
SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.
PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE
PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES
THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO
APPLICABLE LAWS AND REGULATIONS.
06/11/03
4.0
Major revision.
Discontinued XC18V256 density.
Eliminated industrial ordering combinations.
Extended commercial temperature range.
Added MultiPRO Desktop Tool support.
Other minor edits.
12/15/03
4.1
Added specification (4.7 k
Ω) for recommended pull-up resistor on OE/RESET pin to section
Resetbuffer on the DONE pin.
04/05/04
5.0
Major revision.
Figure 2: Revised configuration bitstream lengths for most Virtex-II FPGAs.
Replaced previous schematics in Figures 5, 6, 7(a), 7(b), and 7(c) with new
Figure 5, Figure 6, Replaced previous Figure 8 with new
Figure 9. Added Footnote (5) to:
Numerous copyedits and wording changes/clarifications throughout.
07/20/04
5.0.1
Table 2: Removed reference to XC2VP125 FPGA.
03/06/06
5.1
page 15. Refer to Xilinx Device Package User Guide for package soldering guidelines.
Added information to
Table 5 regarding variable JTAG IDCODE revision field.
01/11/08
5.2
Updated document template.
Updated URLs.
Tied RDWR_B and CS_B to GND to ensure valid logic-level Low in FPGA SelectMAP mode in