參數(shù)資料
型號(hào)： XC2S100-5FG256C
廠商： Xilinx Inc
文件頁(yè)數(shù)： 10/99頁(yè)
文件大?。?/td> 0K
描述： IC FPGA 2.5V 600 CLB'S 256-FBGA
標(biāo)準(zhǔn)包裝： 1
系列： Spartan®-II
LAB/CLB數(shù)： 600
邏輯元件/單元數(shù)： 2700
RAM 位總計(jì)： 40960
輸入/輸出數(shù)： 176
門(mén)數(shù)： 100000
電源電壓： 2.375 V ~ 2.625 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 85°C
封裝/外殼： 256-BGA
供應(yīng)商設(shè)備封裝： 256-FBGA（17x17）
其它名稱： 122-1226
XC2S100-5FG256C-ND
Spartan-II FPGA Family: Functional Description
DS001-2 (v2.8) June 13, 2008
Module 2 of 4
Product Specification
18
R
Signals
There are two kinds of pins that are used to configure
Spartan-II devices: Dedicated pins perform only specific
configuration-related functions; the other pins can serve as
general purpose I/Os once user operation has begun.
The dedicated pins comprise the mode pins (M2, M1, M0),
the configuration clock pin (CCLK), the PROGRAM pin, the
DONE pin and the boundary-scan pins (TDI, TDO, TMS,
TCK). Depending on the selected configuration mode,
CCLK may be an output generated by the FPGA, or may be
generated externally, and provided to the FPGA as an
input.
Note that some configuration pins can act as outputs. For
correct operation, these pins require a VCCO of 3.3V to drive
an LVTTL signal or 2.5V to drive an LVCMOS signal. All the
relevant pins fall in banks 2 or 3. The CS and WRITE pins
for Slave Parallel mode are located in bank 1.
For a more detailed description than that given below, see
"Pinout Tables" in Module 4 and XAPP176, Spartan-II
FPGA Series Configuration and Readback.
The Process
The sequence of steps necessary to configure Spartan-II
devices are shown in Figure 11. The overall flow can be
divided into three different phases.
Initiating Configuration
Configuration memory clear
Loading data frames
Start-up
The memory clearing and start-up phases are the same for
all configuration modes; however, the steps for the loading
of data frames are different. Thus, the details for data frame
loading are described separately in the sections devoted to
each mode.
Initiating Configuration
There are two different ways to initiate the configuration
process: applying power to the device or asserting the
PROGRAM input.
Configuration on power-up occurs automatically unless it is
delayed by the user, as described in a separate section
below. The waveform for configuration on power-up is
shown in Figure 12, page 19. Before configuration can
begin, VCCO Bank 2 must be greater than 1.0V.
Furthermore, all VCCINT power pins must be connected to a
2.5V supply. For more information on delaying
Once in user operation, the device can be re-configured
simply by pulling the PROGRAM pin Low. The device
acknowledges the beginning of the configuration process
by driving DONE Low, then enters the memory-clearing
phase.
Figure 11: Configuration Flow Diagram
FPGA Drives
INIT Low
Abort Start-up
User Holding
INIT
Low?
User Holding
PROGRAM
Low?
FPGA
Drives INIT
and DONE Low
Load
Configuration
Data Frames
User Operation
Configuration
at Power-up
DS001_11_111501
No
CRC
Correct?
Yes
FPGA
Samples
Mode Pins
Delay
Configuration
Delay
Configuration
Clear
Configuration
Memory
User Pulls
PROGRAM
Low
Start-up Sequence
FPGA Drives DONE High,
Activates I/Os,
Releases GSR net
Yes
No
Yes
No
Yes
Configuration During
User Operation
VCCO
AND
VCCINT
High?
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC2S1005-FG256C 制造商:Xilinx 功能描述:Field-Programmable Gate Array, 2700 Cell, 256 Pin, Plastic, BGA
XC2S1005FG256I 制造商:XILINX 功能描述:New
XC2S100-5FG256I 功能描述:IC FPGA 2.5V I-TEMP 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:40 系列:Spartan® 6 LX LAB/CLB數(shù):3411 邏輯元件/單元數(shù):43661 RAM 位總計(jì):2138112 輸入/輸出數(shù):358 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:676-BGA 供應(yīng)商設(shè)備封裝:676-FBGA（27x27）
XC2S1005FG456C 制造商:Xilinx 功能描述:
XC2S100-5FG456C 功能描述:IC FPGA 2.5V 600 CLB'S 456-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門(mén)陣列） 系列:Spartan®-II 標(biāo)準(zhǔn)包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計(jì):226304 輸入/輸出數(shù):131 門(mén)數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應(yīng)商設(shè)備封裝:208-PQFP（28x28）
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