參數(shù)資料
型號(hào): XC6VCX130T-1FFG1156I
廠商: Xilinx Inc
文件頁(yè)數(shù): 24/52頁(yè)
文件大?。?/td> 0K
描述: IC FPGA VIRTEX 6 128K 1156FFGBGA
產(chǎn)品培訓(xùn)模塊: Virtex-6 FPGA Overview
產(chǎn)品變化通告: Virtex-6 FIFO Input Logic Reset 18/Apr/2011
標(biāo)準(zhǔn)包裝: 1
系列: Virtex® 6 CXT
LAB/CLB數(shù): 10000
邏輯元件/單元數(shù): 128000
RAM 位總計(jì): 9732096
輸入/輸出數(shù): 600
電源電壓: 0.95 V ~ 1.05 V
安裝類型: 表面貼裝
工作溫度: -40°C ~ 100°C
封裝/外殼: 1156-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 1156-FCBGA(35x35)
Virtex-6 CXT Family Data Sheet
DS153 (v1.6) February 11, 2011
Product Specification
30
Output Delay Measurements
Output delays are measured using a Tektronix P6245
TDS500/600 probe (< 1 pF) across approximately 4" of FR4
microstrip trace. Standard termination was used for all
testing. The propagation delay of the 4" trace is
characterized separately and subtracted from the final
measurement, and is therefore not included in the
generalized test setups shown in Figure 14 and Figure 15.
Measurements and test conditions are reflected in the IBIS
models except where the IBIS format precludes it.
Parameters VREF, RREF, CREF, and VMEAS fully describe
the test conditions for each I/O standard. The most accurate
prediction of propagation delay in any given application can
be obtained through IBIS simulation, using the following
method:
1.
Simulate the output driver of choice into the generalized
test setup, using values from Table 41.
2.
Record the time to VMEAS.
3.
Simulate the output driver of choice into the actual PCB
trace and load, using the appropriate IBIS model or
capacitance value to represent the load.
4.
Record the time to VMEAS.
5.
Compare the results of steps 2 and 4. The increase or
decrease in delay yields the actual propagation delay of
the PCB trace.
X-Ref Target - Figure 14
Figure 14: Single Ended Test Setup
VREF
RREF
VMEAS
(voltage level when taking
delay measurement)
CREF
(probe capacitance)
FPGA Output
ds152_06_042109
X-Ref Target - Figure 15
Figure 15: Differential Test Setup
RREF VMEAS
+
CREF
FPGA Output
ds152_07_042109
Table 41: Output Delay Measurement Methodology
Description
I/O Standard
Attribute
RREF
(
)
CREF(1)
(pF)
VMEAS
(V)
VREF
(V)
LVCMOS, 2.5V
LVCMOS25
1M
0
1.25
0
LVCMOS, 1.8V
LVCMOS18
1M
0
0.9
0
LVCMOS, 1.5V
LVCMOS15
1M
0
0.75
0
LVCMOS, 1.2V
LVCMOS12
1M
0
0.75
0
HSTL (High-Speed Transceiver Logic), Class I
HSTL_I
50
0
VREF
0.75
HSTL, Class II
HSTL_II
25
0
VREF
0.75
HSTL, Class III
HSTL_III
50
0
0.9
1.5
HSTL, Class I, 1.8V
HSTL_I_18
50
0
VREF
0.9
HSTL, Class II, 1.8V
HSTL_II_18
25
0
VREF
0.9
HSTL, Class III, 1.8V
HSTL_III_18
50
0
1.1
1.8
SSTL (Stub Series Terminated Logic), Class I, 1.8V
SSTL18_I
50
0
VREF
0.9
SSTL, Class II, 1.8V
SSTL18_II
25
0
VREF
0.9
SSTL, Class I, 2.5V
SSTL2_I
50
0
VREF
1.25
SSTL, Class II, 2.5V
SSTL2_II
25
0
VREF
1.25
LVDS (Low-Voltage Differential Signaling), 2.5V
LVDS_25
100
0
1.2
LVDSEXT (LVDS Extended Mode), 2.5V
LVDS_25
100
0
1.2
BLVDS (Bus LVDS), 2.5V
BLVDS_25
100
0
0
相關(guān)PDF資料
PDF描述
ASM40DTAS-S189 CONN EDGECARD 80POS R/A .156 SLD
AGM40DTAS-S189 CONN EDGECARD 80POS R/A .156 SLD
AMM36DRKS CONN EDGECARD 72POS DIP .156 SLD
XC5VLX85-1FF1153C IC FPGA VIRTEX-5 85K 1153FBGA
FMC22DRYS-S93 CONN EDGECARD 44POS .100 DIP SLD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
XC6VCX130T-1FFG484C 功能描述:IC FPGA VIRTEX 6 128K 484FFGBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Virtex® 6 CXT 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC6VCX130T-1FFG484I 功能描述:IC FPGA VIRTEX 6 128K 484FFGBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Virtex® 6 CXT 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC6VCX130T-1FFG784C 功能描述:IC FPGA VIRTEX 6 128K 784FFGBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Virtex® 6 CXT 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC6VCX130T-1FFG784I 功能描述:IC FPGA VIRTEX 6 128K 784FFGBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場(chǎng)可編程門陣列) 系列:Virtex® 6 CXT 產(chǎn)品變化通告:Step Intro and Pkg Change 11/March/2008 標(biāo)準(zhǔn)包裝:1 系列:Virtex®-5 SXT LAB/CLB數(shù):4080 邏輯元件/單元數(shù):52224 RAM 位總計(jì):4866048 輸入/輸出數(shù):480 門數(shù):- 電源電壓:0.95 V ~ 1.05 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 100°C 封裝/外殼:1136-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC6VCX130T-2FF1156C 制造商:Xilinx 功能描述:FPGA VIRTEX?-6 CXT FAMILY 128000 CELLS 40NM (CMOS) TECHNOLOG - Trays 制造商:Xilinx 功能描述:IC FPGA 600 I/O 1156FCBGA 制造商:Xilinx 功能描述:IC FPGA VIRTEX 6 128K 1156BGA