- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄372925 > XPC850CZT66BU Microprocessor PDF資料下載
參數(shù)資料
| 型號(hào)： | XPC850CZT66BU |
| 英文描述： | Microprocessor |
| 中文描述： | 微處理器 |
| 文件頁(yè)數(shù)： | 8/76頁(yè) |
| 文件大?。?/td> | 825K |
| 代理商： | XPC850CZT66BU |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)當(dāng)前第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)
8
MPC850 (Rev. A/B/C) Hardware Specifications
MOTOROLA
This device contains circuitry protecting against damage due to high-static voltage or
electrical fields; however, it is advised that normal precautions be taken to avoid application
of any voltages higher than maximum-rated voltages to this high-impedance circuit.
Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage
level (for example, either GND or V
CC
). Table 4-3 provides the package thermal
characteristics for the MPC850.
Table 3-2. Maximum Ratings
(GND = 0V)
Rating
Symbol
Value
Unit
Supply voltage
VDDH
-0.3 to 4.0
V
VDDL
-0.3 to 4.0
V
KAPWR
-0.3 to 4.0
V
VDDSYN
-0.3 to 4.0
V
Input voltage
1
1
Functional operating conditions are provided with the DC electrical specifications in Table 4-5. Absolute maximum
ratings are stress ratings only; functional operation at the maxima is not guaranteed. Stress beyond those listed may
affect device reliability or cause permanent damage to the device.
CAUTION: All inputs that tolerate 5 V cannot be more than 2.5 V greater than the supply voltage. This restriction
applies to power-up and normal operation (that is, if the MPC850 is unpowered, voltage greater than 2.5 V must not
be applied to its inputs).
The MPC850, a high-frequency device in a BGA package, does not provide a guaranteed maximum ambient
temperature. Only maximum junction temperature is guaranteed. It is the responsibility of the user to consider power
dissipation and thermal management. Junction temperature ratings are the same regardless of frequency rating of
the device.
V
in
GND-0.3 to VDDH + 2.5 V
V
Junction temperature
2
2
T
j
0 to 95 (standard)
-40 to 95 (extended)
C
Storage temperature range
T
stg
-55 to +150
C
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| XPC850DECZT50BU | Microprocessor |
| XPC850DECZT66BU | Microprocessor |
| XPC850DEZT50BU | Microprocessor |
| XPC850SRZT66BU | Microprocessor |
| XPC850SRZT80BU | Microprocessor |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| XPC850CZT80B | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Communications Controller Hardware Specifications |
| XPC850DECVR50BU | 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤 |
| XPC850DECVR66BU | 功能描述:IC MPU POWERQUICC 66MHZ 256-PBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:2 系列:MPC8xx 處理器類型:32-位 MPC8xx PowerQUICC 特點(diǎn):- 速度:133MHz 電壓:3.3V 安裝類型:表面貼裝 封裝/外殼:357-BBGA 供應(yīng)商設(shè)備封裝:357-PBGA（25x25） 包裝:托盤 |
| XPC850DECZT50B | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:Communications Controller Hardware Specifications |
| XPC850DECZT50BU | 功能描述:IC MPU POWERQUICC 50MHZ 256-PBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC8xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點(diǎn):- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤 |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。