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參數(shù)資料
| 型號： | XS1-G02B-FB144-C4 |
| 廠商： | XMOS |
| 文件頁數(shù)： | 24/24頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MCU 32BIT 16KB OTP 144FBGA |
| 標準包裝： | 176 |
| 系列： | XS1 |
| 核心處理器： | XCore |
| 芯體尺寸： | 32 位雙核 |
| 速度： | 400MHz |
| 連通性： | USB |
| 輸入/輸出數(shù)： | 88 |
| 程序存儲器容量： | 16KB（4K x 32） |
| 程序存儲器類型： | OTP |
| RAM 容量： | 32K x 32 |
| 電壓 - 電源 (Vcc/Vdd)： | 0.95 V ~ 3.6 V |
| 振蕩器型： | 外部 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 144-FBGA |
| 包裝： | 托盤 |
| 其它名稱： | 880-1006 |
XS1-G02B-FB144 Datasheet
8
5
Product Overview
The XMOS XS1-G02B-FB144 is a powerful device that provides a simple design
process and highly-exible solution to many applications. The device consists of
two XCores, each comprising an event-driven processor with tightly integrated
I/O and on-chip memory. The processors run mutiple tasks simultaneously using
hardware threads, each of which is guaranteed a slice of processing power and
can execute computational code, control software and I/O interfaces. Threads use
channels to exchange data within a core or across cores. The cores are connected
via an integrated switch network, which uses a proprietary physical layer protocol,
and which can also be used to add additional resources to a design. The I/O pins
are driven using intelligent ports that can serialize data, interpret strobe signals
and wait for scheduled times or events, making the device ideal for real-time
control applications.
The device can be congured using a set of software components that are rapidly
customized and composed. XMOS provides source code libraries for many standard
components. The device can be programmed using high-level languages such as
C/C++ and the XMOS-originated XC language. XC provides extensions to C that
simplify the control over concurrency, I/O and time.
The XMOS toolchain includes compilers, a simulator, debugger and static timing
analyzer. The combination of real-time software, a compiler and timing analyzer
enables the programmer to close timings on components of the design without a
detailed understanding of the hardware characteristics.
5.1
Threads, Synchronizers and Locks
Each XCore has up to eight active threads, which issue instructions down a shared
four-stage pipeline. Instructions from the active threads are issued round-robin. If
up to four threads are active, each thread is allocated a quarter of the processing
cycles. If more than four threads are active, each thread is allocated at least
1
depending on the number of threads used.
Speed Grade
Minimum MIPS per thread (for n threads)
1
2
3
4
5
6
7
8
400 MHz
100
80
67
57
50
Figure 1:
Thread
performance
There is no way that the performance of a thread can be reduced below these
predicted levels. Because threads may be delayed on I/O, however, their unused
processor cycles can be taken by other threads. This means that for more than
four threads, the performance of each thread is often higher than the predicted
minimum.
Document Number: 1100C
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| XS1-G02B-FB144-I4 | 功能描述:IC MCU 32BIT 16KB OTP 144FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:XS1 產(chǎn)品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:260 系列:73S12xx 核心處理器:80515 芯體尺寸:8-位 速度:24MHz 連通性:I²C，智能卡，UART/USART，USB 外圍設備:LED，POR，WDT 輸入/輸出數(shù):9 程序存儲器容量:64KB（64K x 8） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:2K x 8 電壓 - 電源 (Vcc/Vdd):2.7 V ~ 5.5 V 數(shù)據(jù)轉換器:- 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:68-VFQFN 裸露焊盤 包裝:管件 |
| XS1-G04B-FB144-C4 | 功能描述:IC MCU 32BIT 32KB OTP 144FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:XS1 標準包裝:96 系列:PIC® 16F 核心處理器:PIC 芯體尺寸:8-位 速度:20MHz 連通性:I²C，SPI 外圍設備:欠壓檢測/復位，POR，PWM，WDT 輸入/輸出數(shù):11 程序存儲器容量:3.5KB（2K x 14） 程序存儲器類型:閃存 EEPROM 大小:- RAM 容量:128 x 8 電壓 - 電源 (Vcc/Vdd):2.3 V ~ 5.5 V 數(shù)據(jù)轉換器:A/D 8x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 125°C 封裝/外殼:14-TSSOP（0.173"，4.40mm 寬） 包裝:管件 |
| XS1-G04B-FB144-I4 | 功能描述:IC MCU 32BIT 32KB OTP 144FBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:XS1 標準包裝:27 系列:PIC® 16C 核心處理器:PIC 芯體尺寸:8-位 速度:10MHz 連通性:I²C，SPI，UART/USART 外圍設備:欠壓檢測/復位，POR，PWM，WDT 輸入/輸出數(shù):22 程序存儲器容量:14KB（8K x 14） 程序存儲器類型:OTP EEPROM 大小:- RAM 容量:368 x 8 電壓 - 電源 (Vcc/Vdd):4 V ~ 6 V 數(shù)據(jù)轉換器:A/D 5x8b 振蕩器型:外部 工作溫度:-40°C ~ 125°C 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 包裝:管件 |
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