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參數(shù)資料
| 型號(hào)： | 49LF002 |
| 廠商： | Silicon Storage Technology, Inc. |
| 英文描述： | 2 Mbit / 3 Mbit / 4 Mbit / 8 Mbit Firmware Hub |
| 中文描述： | 2兆位/ 3兆/ 4兆位/ 8兆固件集線器 |
| 文件頁數(shù)： | 30/36頁 |
| 文件大?。?/td> | 412K |
| 代理商： | 49LF002 |
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36
Advance Information
2 Mbit / 3 Mbit / 4 Mbit / 8 Mbit Firmware Hub
SST49LF002A / SST49LF003A / SST49LF004A / SST49LF008A
2001 Silicon Storage Technology, Inc.
S71161-06-000
9/01
504
PACKAGING DIAGRAMS
32-LEAD PLASTIC LEAD CHIP CARRIER (PLCC)
SST PACKAGE CODE: NH
32-LEAD THIN SMALL OUTLINE PACKAGE (TSOP) 8MM X 14MM
SST PACKAGE CODE: WH
.040
.030
.021
.013
.530
.490
.095
.075
.015 Min.
.140
.125
TOP VIEW
SIDE VIEW
BOTTOM VIEW
1
232
.032
.026
.400
BSC
32-plcc-NH-ILL.2
Note: 1. Complies with JEDEC publication 95 MS-016 AE dimensions, although some dimensions may be more stringent.
2. All linear dimensions are in inches (max/min).
3. Dimensions do not include mold flash. Maximum allowable mold flash is .008 inches.
4. Coplanarity: 4 mils.
.050
BSC
.050
BSC
.032
.026
.029
.023
.453
.447
.042
.048
.042
Optional
Pin #1 Identifier
.553
.547
.595
.585
.495
.485
.020 R.
MAX.
.112
.106
R.
x 30
32-tsop-WH-ILL.6
Note: 1. Complies with JEDEC publication 95 MO-142 BA dimensions,
although some dimensions may be more stringent.
2. All linear dimensions are in millimeters (max/min).
3. Coplanarity: 0.1 (±.05) mm.
4. Maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads.
1.20
max.
1mm
Pin # 1 Identifier
12.50
12.30
14.20
13.80
0.70
0.50
8.10
7.90
0.27
0.17
0.50
BSC
1.05
0.95
0.15
0.05
0.70
0.50
0- 5
DETAIL
Silicon Storage Technology, Inc. 1171 Sonora Court Sunnyvale, CA 94086 Telephone 408-735-9110 Fax 408-735-9036
www.SuperFlash.com or www.ssti.com
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