參數(shù)資料
型號(hào): 80960JS
廠商: Intel Corp.
英文描述: High Performance 32-bit Embedded 3.3V Microprocessor(3.3V高性能32位嵌入式處理器)
中文描述: 高性能32位嵌入式微處理器3.3(3.3高性能32位嵌入式處理器)
文件頁數(shù): 36/86頁
文件大小: 1257K
代理商: 80960JS
80960JA/JF/JD/JS/JC/JT 3.3 V Microprocessor
36
Datasheet
Table 17. 132-Lead PGA Package Thermal Characteristics
Thermal Resistance
°
C/Watt
Parameter
Airflow
ft./min (m/sec)
0
(0)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
1000
(5.08)
θ
JC
(Junction-to-Case)
θ
CA
(Case-to-Ambient) (No Heatsink)
θ
CA
(Case-to-Ambient) (Omnidirectional Heatsink)
θ
CA
(Case-to-Ambient) (Unidirectional Heatsink)
0.7
25
15
16
0.7
19
9
8
0.7
14
6
6
0.7
12
5
5
0.7
11
4
4
0.7
10
4
4
NOTES:
1. This table applies to a PGA device plugged into a socket or soldered directly into a board.
2.
θ
JA
=
θ
JC
+
θ
CA
3.
θ
J-CAP
= 5.6
°
C/W (approximate) (no heatsink)
4.
θ
J-PIN
= 6.4
°
C/W (inner pins) (approximate) (no heatsink)
5.
θ
J-PIN
= 6.2
°
C/W (outer pins) (approximate) (no heatsink)
6.
θ
J-CAP
= 3
°
C/W (approximate) (with heatsink)
7.
θ
J-PIN
= 3.3
°
C/W (inner pins) (approximate) (with heatsink)
8.
θ
J-PIN
= 3.3
°
C/W (outer pins) (approximate) (with heatsink)
Table 18. 80960JA/JF/JD 196-Ball MPBGA Package Thermal Characteristics
Thermal Resistance
°
C/Watt
Parameter
Airflow
ft./min (m/sec)
0
(0)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
1000
(5.08)
θ
JC
(Junction-to-Case)
θ
CA
(Case-to-Ambient) (No Heatsink)
2
30
2
22
2
20
2
19
2
18
2
18
NOTES:
1. This table applies to an MPBGA device soldered directly into a board with all V
SS
connections.
2.
θ
JA
=
θ
JC
+
θ
CA
θ
JC
θ
JA
θ
J-CAP
θ
CA
θ
J-PIN
θ
JA
θ
JC
θ
CA
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