參數(shù)資料
型號: A54SX32A-CQG208C
元件分類: FPGA
英文描述: FPGA, 2880 CLBS, 32000 GATES, 206 MHz, CQFP208
封裝: CERAMIC, QFP-208
文件頁數(shù): 10/40頁
文件大小: 738K
代理商: A54SX32A-CQG208C
18
J unc t i on T e m p e r at ur e ( T J)
The temperature variable in the Designer Series software
refers to the junction temperature, not the ambient
temperature. This is an important distinction because the
heat generated from dynamic power consumption is usually
hotter than the ambient temperature. Equation 4, shown
below, can be used to calculate junction temperature.
Junction Temperature =
T + Ta
(4)
Where:
Ta = Ambient Temperature
T = Temperature gradient between junction (silicon) and
ambient
T = θ
ja * P
P = Power calculated from Estimating Power Consumption
section
θja = Junction to ambient of package. θja numbers are
located in the Package Thermal Characteristics section
below.
Pa cka ge The r m a l Cha r act e r i s t i cs
The device junction to case thermal characteristic is
θjc,
and the junction to ambient air characteristic is
θ
ja. The
thermal characteristics for
θja are shown with two different
air flow rates.
The maximum junction temperature is 150
°C.
A sample calculation of the absolute maximum power
dissipation allowed for a CQFP 256-pin package at
commercial temperature and still air is as follows:
Package Type
Pin Count
θjc
θja
Still Air
θja
300 ft/min
Units
Ceramic Quad Flatpack (CQFP)
208
6.3
22
14
°C/W
Ceramic Quad Flatpack (CQFP)
256
6.2
20
10
°C/W
Maximum Power Allowed
Max. junction temp. (
°C) Max. ambient temp. (°C)
θ
ja(°C/W)
---------------------------------------------------------------------------------------------------------------------------------
150
°C70°C
20
°C/W
-----------------------------------
4.0W
=
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