參數資料
型號： A54SX32A-CQG208C
元件分類： FPGA
英文描述： FPGA, 2880 CLBS, 32000 GATES, 206 MHz, CQFP208
封裝： CERAMIC, QFP-208
文件頁數： 36/40頁
文件大小： 738K
代理商： A54SX32A-CQG208C
5
Hi R e l S X -A F a m i l y F P G A s
S X -A F a m ily A r c h ite c t u r e
The SX-A family architecture was designed to satisfy
next-generation performance and integration requirements
for production-volume designs in a broad range of
applications.
P rog ra m ma b l e Int e r con nect E l em ent
The SX-A family provides efficient use of silicon by locating
the routing interconnect resources between the Metal 2
(M2) and Metal 3 (M3) layers (Figure 1). This completely
eliminates the channels of routing and interconnect
resources between logic modules (as implemented on
SRAM FPGAs and previous generations of antifuse FPGAs),
and enables the entire floor of the device to be spanned
with an uninterrupted grid of logic modules.
Interconnection between these logic modules is achieved
using
Actel’s
patented
metal-to-metal
programmable
antifuse interconnect elements, which are embedded
between the M2 and M3 layers. The antifuses are normally
open circuit and, when programmed, form a permanent
low-impedance connection.
The extremely small size of these interconnect elements
gives the SX-A family abundant routing resources and
provides excellent protection against design pirating.
Reverse engineering is virtually impossible because it is
extremely difficult to distinguish between programmed and
unprogrammed antifuses, and there is no configuration
bitstream to intercept.
Additionally, the interconnect (i.e., the antifuses and metal
tracks) have lower capacitance and lower resistance than
any other device of similar capacity, leading to the fastest
signal propagation in the industry.
Note:
A54SX72A has 4 layers of metal with the antifuse between Metal 3 and Metal 4.
Figure 1 SX-A Family Interconnect Elements
Silicon Substrate
Tungsten Plug
Contact
Metal 1
Metal 2
Metal 3
Routing Tracks
Amorphous Silicon/
Dielectric Antifuse
Tungsten Plug Via
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相關代理商/技術參數
參數描述
A54SX32A-FBG329 功能描述:IC FPGA SX 48K GATES 329-BGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:SX-A 標準包裝:40 系列:SX-A LAB/CLB數:6036 邏輯元件/單元數:- RAM 位總計:- 輸入/輸出數:360 門數:108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA（27X27）
A54SX32A-FBGG329 功能描述:IC FPGA SX 48K GATES 329-BGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:SX-A 標準包裝:40 系列:SX-A LAB/CLB數:6036 邏輯元件/單元數:- RAM 位總計:- 輸入/輸出數:360 門數:108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA（27X27）
A54SX32A-FFG144 功能描述:IC FPGA SX 48K GATES 144-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:SX-A 標準包裝:90 系列:ProASIC3 LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:36864 輸入/輸出數:157 門數:250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA（17x17）
A54SX32A-FFG256 功能描述:IC FPGA SX 48K GATES 256-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:SX-A 標準包裝:90 系列:ProASIC3 LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:36864 輸入/輸出數:157 門數:250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA（17x17）
A54SX32A-FFG484 功能描述:IC FPGA SX 48K GATES 484-FBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現場可編程門陣列） 系列:SX-A 標準包裝:40 系列:SX-A LAB/CLB數:6036 邏輯元件/單元數:- RAM 位總計:- 輸入/輸出數:360 門數:108000 電源電壓:2.25 V ~ 5.25 V 安裝類型:表面貼裝 工作溫度:0°C ~ 70°C 封裝/外殼:484-BGA 供應商設備封裝:484-FPBGA（27X27）
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