AD7834/AD7835
Rev. D | Page 7 of 28
ABSOLUTE MAXIMUM RATINGS
TA = 25°C unless otherwise noted. Transient currents of up to 100 mA do not cause SCR latch-up. VCC must not exceed VDD by more than
0.3 V. If it is possible for this to happen during power supply sequencing, the diode protection scheme shown in
Figure 5 can be used to
provide protection.
Table 5.
AD7834/
AD7835
VDD
VCC
IN4148
SD103C
VDD
VCC
01006-005
Parameter
Rating
VCC to DGND
0.3 V to +7 V, or VDD + 0.3 V
(whichever is lower)
VDD to AGND
0.3 V to +17 V
VSS to AGND
+0.3 V to –17 V
Figure 5. Diode Protection
AGND to DGND
0.3 V to +0.3 V
0.3 V to VCC + 0.3 V
Digital Inputs to DGND
THERMAL RESISTANCE
VREF(+) to VREF(–)
0.3 V to +18 V
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
VREF(+) to AGND
VSS – 0.3 V to VDD + 0.3 V
VREF(–) to AGND
VSS – 0.3 V to VDD + 0.3 V
DSG to AGND
Table 6. Thermal Resistance
VOUT (1–4) to AGND
VSS – 0.3 V to VDD + 0.3 V
Package Type
θJA
Unit
Operating Temperature Range, TA
PDIP
75
°C/W
40°C to +85°C
Industrial (A Version)
SOIC
75
°C/W
65°C to +150°C
Storage Temperature Range
MQFP
95
°C/W
150°C
Junction Temperature, TJ (max)
PLCC
55
°C/W
Power Dissipation, PD (max)
(TJ TA)/θJA
Lead Temperature
JEDEC Industry Standard
ESD CAUTION
Soldering
J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.