參數(shù)資料
型號(hào): AD9637-80EBZ
廠商: Analog Devices Inc
文件頁(yè)數(shù): 37/40頁(yè)
文件大?。?/td> 0K
描述: BOARD EVAL FOR AD9637
標(biāo)準(zhǔn)包裝: 1
系列: *
AD9637
Data Sheet
Rev. A | Page 6 of 40
SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = 1.0 dBFS, unless otherwise noted.
Table 4.
Parameter1, 2
Temp
Min
Typ
Max
Unit
CLOCK3
Input Clock Rate
Full
10
640
MHz
Conversion Rate
Full
10
40/80
MSPS
Clock Pulse Width High (tEH)
Full
12.5/6.25
ns
Clock Pulse Width Low (tEL)
Full
12.5/6.25
ns
OUTPUT PARAMETERS3
Propagation Delay (tPD)
Full
1.5
2.3
3.1
ns
Rise Time (tR) (20% to 80%)
Full
300
ps
Fall Time (tF) (20% to 80%)
Full
300
ps
FCO Propagation Delay (tFCO)
Full
1.5
2.3
3.1
ns
DCO Propagation Delay (tCPD)4
Full
tFCO + (tSAMPLE/24)
ns
DCO to Data Delay (tDATA)4
Full
(tSAMPLE/24) 300
(tSAMPLE/24)
(tSAMPLE/24) + 300
ps
DCO to FCO Delay (tFRAME)4
Full
(tSAMPLE/24) 300
(tSAMPLE/24)
(tSAMPLE/24) + 300
ps
Data to Data Skew
(tDATA-MAX tDATA-MIN)
Full
±50
±200
ps
Wake-Up Time (Standby)
25°C
35
μs
Wake-Up Time (Power-Down)5
25°C
375
μs
Pipeline Latency
Full
16
Clock
cycles
APERTURE
Aperture Delay (tA)
25°C
1
ns
Aperture Uncertainty (Jitter)
25°C
0.1
ps rms
Out-of-Range Recovery Time
25°C
1
Clock
cycles
1
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for definitions and for details on how these tests were completed.
2
Measured on standard FR-4 material.
3
Can be adjusted via the SPI.
4
tSAMPLE/24 is based on the number of bits divided by 2 because the delays are based on half duty cycles. tSAMPLE = 1/fS.
5
Wake-up time is defined as the time required to return to normal operation from power-down mode.
TIMING SPECIFICATIONS
Table 5.
Parameter
Description
Limit
Unit
SYNC TIMING REQUIREMENTS
tSSYNC
SYNC to rising edge of CLK+ setup time
0.24
ns typ
tHSYNC
SYNC to rising edge of CLK+ hold time
0.40
ns typ
SPI TIMING REQUIREMENTS
tDS
Setup time between the data and the rising edge of SCLK
2
ns min
tDH
Hold time between the data and the rising edge of SCLK
2
ns min
tCLK
Period of the SCLK
40
ns min
tS
Setup time between CSB and SCLK
2
ns min
tH
Hold time between CSB and SCLK
2
ns min
tHIGH
SCLK pulse width high
10
ns min
tLOW
SCLK pulse width low
10
ns min
tEN_SDIO
Time required for the SDIO pin to switch from an input to an output relative to
the SCLK falling edge (not shown in Figure 61)
10
ns min
tDIS_SDIO
Time required for the SDIO pin to switch from an output to an input relative to
the SCLK rising edge (not shown in Figure 61)
10
ns min
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