參數(shù)資料
型號(hào): AD9737A-EBZ
廠商: Analog Devices Inc
文件頁數(shù): 60/64頁
文件大?。?/td> 0K
描述: BOARD EVAL FOR AD9737A
標(biāo)準(zhǔn)包裝: 1
系列: *
Data Sheet
AD9737A/AD9739A
Rev. C | Page 63 of 64
OUTLINE DIMENSIONS
12.10
12.00 SQ
11.90
0.43 MAX
0.25 MIN
1.00 MAX
0.85 MIN
A
B
C
D
E
F
G
H
J
K
L
M
N
P
14
13
12
11
10
8
7
6
3
2
1
9
5
4
1.40 MAX
0.55
0.50
0.45
10.40
BSC SQ
11
-1
8
-2
0
1
-A
COMPLIANT WITH JEDEC STANDARDS MO-275-GGAA-1.
COPLANARITY
0.12
BALL DIAMETER
0.80
BSC
DETAIL A
A1 BALL
CORNER
A1 BALL
CORNER
DETAIL A
BOTTOM VIEW
TOP VIEW
SEATING
PLANE
Figure 189. 160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-160-1)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature Range
Package Description
Package Option
AD9737ABBCZ
40°C to +85°C
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
BC-160-1
AD9737ABBCZRL
40°C to +85°C
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
BC-160-1
AD9737A-EBZ
Evaluation Board for Normal, CMTS, and Mix-Mode Evaluation
AD9739ABBCZ
40°C to +85°C
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
BC-160-1
AD9739ABBCZRL
40°C to +85°C
160- Ball Chip Scale Package Ball Grid Array [CSP_BGA]
BC-160-1
AD9739A-EBZ
Evaluation Board for Normal, CMTS, and Mix-Mode Evaluation
AD9739A-FMC-EBZ
Evaluation Board with FMC connector for Xilinx based FPGA
development platforms
1 Z = RoHS Compliant Part.
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