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參數(shù)資料
| 型號： | AD9912A/PCBZ |
| 廠商： | Analog Devices Inc |
| 文件頁數(shù)： | 17/40頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD EVALUATION FOR AD9912 |
| 產(chǎn)品培訓模塊： | Direct Digital Synthesis Tutorial Series (1 of 7): Introduction Direct Digital Synthesizer Tutorial Series (7 of 7): DDS in Action Direct Digital Synthesis Tutorial Series (3 of 7): Angle to Amplitude Converter Direct Digital Synthesis Tutorial Series (6 of 7): SINC Envelope Correction Direct Digital Synthesis Tutorial Series (4 of 7): Digital-to-Analog Converter Direct Digital Synthesis Tutorial Series (2 of 7): The Accumulator |
| 標準包裝： | 1 |
| 主要目的： | 計時，直接數(shù)字合成（DDS） |
| 嵌入式： | 否 |
| 已用 IC / 零件： | AD9912 |
| 主要屬性： | 14 位數(shù)模轉(zhuǎn)換器，48 位調(diào)節(jié)字寬 |
| 次要屬性： | 1GHz 圖形用戶界面 |
| 已供物品： | 板 |
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AD9912
Rev. F | Page 24 of 40
THERMAL PERFORMANCE
Table 7. Thermal Parameters
Symbol
Thermal Characteristic Using a JEDEC51-7 Plus JEDEC51-5 2S2P Test Board
Value
Unit
θJA
Junction-to-ambient thermal resistance, 0.0 m/sec air flow per JEDEC JESD51-2 (still air)
25.2
°C/W
θJMA
Junction-to-ambient thermal resistance, 1.0 m/sec air flow per JEDEC JESD51-6 (moving air)
22.0
°C/W
θJMA
Junction-to-ambient thermal resistance, 2.0 m/sec air flow per JEDEC JESD51-6 (moving air)
19.8
°C/W
θJB
Junction-to-board thermal resistance, 1.0 m/sec air flow per JEDEC JESD51-8 (moving air)
13.9
°C/W
θJC
Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1
1.7
°C/W
ΨJT
Junction-to-top-of-package characterization parameter, 0 m/sec air flow per JEDEC JESD51-2 (still air)
0.1
°C/W
The AD9912 is specified for a case temperature (TCASE). To
ensure that TCASE is not exceeded, an airflow source can be used.
Use the following equation to determine the junction tempera-
ture on the application PCB:
TJ
= TCASE + (ΨJT × PD)
where:
TJ
is the junction temperature (°C).
TCASE
is the case temperature (°C) measured by customer at top
center of package.
ΨJT
is the value from Table 7.
PD
is the power dissipation (see the Total Power Dissipation
section in the Specifications section).
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order
approximation of TJ by the equation
TJ
= TA + (θJA × PD)
where TA is the ambient temperature (°C).
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
Values of θJB are provided for package comparison and PCB
design considerations.
The values in Table 7 apply to both 64-lead package options.
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相關(guān)代理商/技術(shù)參數(shù) |
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|---|---|
| AD9912BCPZ | 制造商:Analog Devices 功能描述:Direct Digital Synthesizer 1000MHz 1-DAC 14-Bit Serial 64-Pin LFCSP EP 制造商:Analog Devices 功能描述:DIRECT DGTL SYNTHESIZER 64LFCSP EP - Trays 制造商:Analog Devices 功能描述:IC DDS 1GSPS 14BIT DAC |
| AD9912BCPZ-REEL7 | 制造商:Analog Devices 功能描述:DIRECT DGTL SYNTHESIZER 64LFCSP EP - Tape and Reel |
| AD9913 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Low Power 250 MSPS 10-Bit DAC 1.8 V CMOS Direct Digital Synthesizer |
| AD9913/PCBZ | 功能描述:數(shù)據(jù)轉(zhuǎn)換 IC 開發(fā)工具 Sub 50mW 250MSPS (+) 10-bit DDS RoHS:否 制造商:Texas Instruments 產(chǎn)品:Demonstration Kits 類型:ADC 工具用于評估:ADS130E08 接口類型:SPI 工作電源電壓:- 6 V to + 6 V |
| AD9913/PCBZ1 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Low Power 250 MSPS 10-Bit DAC 1.8 V CMOS Direct Digital Synthesizer |
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