ADF4360-9
Data Sheet
Rev. C | Page 24 of 24
OUTLINE DIMENSIONS
COMPLIANT
TO JEDEC STANDARDS MO-220-VGGD-2
04-
09-
2012-
A
1
0.50
BSC
PIN 1
INDICATOR
2.50 REF
0.50
0.40
0.30
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
0.25 MIN
2.45
2.30 SQ
2.15
24
7
19
12
13
18
6
0.60 MAX
PIN 1
INDICATOR
4.10
4.00 SQ
3.90
3.75 BSC
SQ
EXPOSED
PAD
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
BOTTOM VIEW
Figure 36. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-24-2)
Dimensions shown in millimeters
ORDERING GUIDE
Temperature Range
Package Description
Frequency Range
Package Option
ADF4360-9BCPZ
40°C to +85°C
24-Lead LFCSP_VQ
65 MHz to 400 MHz
CP-24-2
ADF4360-9BCPZRL
40°C to +85°C
24-Lead LFCSP_VQ
65 MHz to 400 MHz
CP-24-2
ADF4360-9BCPZRL7
40°C to +85°C
24-Lead LFCSP_VQ
65 MHz to 400 MHz
CP-24-2
EV-ADF4360-9EB1Z
Evaluation Board
1
Z = RoHS Compliant Part.
2008–2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07139-0-11/12(C)