參數(shù)資料
型號： AGLP125V5CSG281I
元件分類： FPGA
英文描述： FPGA, 3120 CLBS, 125000 GATES, PBGA281
封裝： 10 X 10 MM, 1.05 MM HEIGHT, 0.5 MM PITCH, ROHS COMPLIANT, CSP-281
文件頁數(shù)： 42/128頁
文件大小： 4383K
代理商： AGLP125V5CSG281I
IGLOO PLUS DC and Switching Characteristics
2- 6
R ev isio n 1 1
Thermal Characteristics
Introduction
The temperature variable in the Actel Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction temperature to be higher than the ambient temperature.
EQ 1 can be used to calculate junction temperature.
TJ = Junction Temperature = ΔT + TA
EQ 1
where:
TA = Ambient temperature
ΔT = Temperature gradient between junction (silicon) and ambient ΔT = θ
ja * P
θ
ja = Junction-to-ambient of the package. θja numbers are located in Figure 2-5.
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is
θ
jc and the junction-to-ambient air thermal resistivity is
θ
ja. The thermal characteristics for θja are shown for two air flow rates. The maximum operating junction
temperature is 100°C. EQ 2 shows a sample calculation of the maximum operating power dissipation
allowed for a 484-pin FBGA package at commercial temperature and in still air.
EQ 2
Temperature and Voltage Derating Factors
Maximum Power Allowed
Max. junction temp. (
°C) Max. ambient temp. (°C)
–
θ
ja(°C/W)
------------------------------------------------------------------------------------------------------------------------------------------
100
°C70°C
–
20.5°C/W
-------------------------------------
1.46 W
=
Table 2-5 Package Thermal Resistivities
Package Type
Pin
Count
θ
jc
θ
ja
Units
Still Air
200 ft./
min.
500 ft./
min.
Chip Scale Package (CSP)
201
TBD
C/W
281
TBD
C/W
289
TBD
C/W
Very Thin Quad Flat Package (VQFP)
128
TBD
C/W
176
TBD
C/W
Table 2-6 Temperature and Voltage Derating Factors for Timing Delays (normalized to TJ = 70°C,
VCC =1.425 V)
For IGLOO PLUS V2 or V5 devices, 1.5 V DC Core Supply Voltage
Array Voltage
VCC (V)
Junction Temperature (°C)
–40°C
0°C
25°C
70°C
85°C
100°C
1.425
0.934
0.953
0.971
1.000
1.007
1.013
1.5
0.855
0.874
0.891
0.917
0.924
0.929
1.575
0.799
0.816
0.832
0.857
0.864
0.868
相關PDF資料
PDF描述
AGLP125V5CSG281 FPGA, 3120 CLBS, 125000 GATES, PBGA281
AGLP125V5CSG289I FPGA, 3120 CLBS, 125000 GATES, PBGA289
AGLP125V5CSG289 FPGA, 3120 CLBS, 125000 GATES, PBGA289
AGLP060V2-CS201I FPGA, 1584 CLBS, 60000 GATES, PBGA201
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相關代理商/技術參數(shù)
參數(shù)描述
AGLP125V5-CSG281I 功能描述:IC FPGA IGLOO PLUS 125K 281-CSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:IGLOO PLUS 標準包裝:90 系列:ProASIC3 LAB/CLB數(shù):- 邏輯元件/單元數(shù):- RAM 位總計:36864 輸入/輸出數(shù):157 門數(shù):250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA（17x17）
AGLP125-V5CSG289 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP125V5-CSG289 功能描述:IC FPGA IGLOO PLUS 125K 289-CSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:IGLOO PLUS 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應商設備封裝:289-CSP（14x14）
AGLP125-V5CSG289ES 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
AGLP125-V5CSG289I 制造商:ACTEL 制造商全稱:Actel Corporation 功能描述:IGLOO PLUS Low-Power Flash FPGAs with FlashFreeze Technology
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