參數(shù)資料
型號(hào)： AM29LV800DB-120WCC
廠商： Advanced Micro Devices, Inc.
英文描述： Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 180pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-5%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Solder Coated (Sn/Pb, 70/30); Body Dimensions: 0.080" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: R Failure Rate
中文描述： 8兆位（1 M中的x 8-Bit/512畝x 16位），3.0伏的CMOS只引導(dǎo)扇區(qū)閃存
文件頁(yè)數(shù)： 9/51頁(yè)
文件大小： 1628K
代理商： AM29LV800DB-120WCC
January 21, 2005 Am29LV800D_00_A4_E
Am29LV800D
7
P R E L I M I N A R Y
Special Handling Instructions for FBGA
Package
Special handling is required for Flash Memory
products in FBGA packages.
Flash memory devices in FBGA packages may
be damaged if exposed to ultrasonic cleaning
methods. The package and/or data integrity
may be compromised if the package body is
exposed to temperatures above 150
°
C for pro-
longed periods of time.
Pin Configuration
A0–A18
= 19 addresses
DQ0–DQ14= 15 data inputs/outputs
DQ15/A-1 = DQ15 (data input/output, word
mode),
A-1 (LSB address input, byte
mode)
BYTE#
= Selects 8-bit or 16-bit mode
CE#
= Chip enable
OE#
= Output enable
WE#
= Write enable
RESET#
= Hardware reset pin, active low
RY/BY#
= Ready/Busy# output
V
CC
= 3.0 volt-only single power supply
(see Product Selector Guide for
speed
options and voltage supply
tolerances)
V
SS
NC
= Device ground
= Pin not connected internally
Logic Symbol
19
16 or 8
DQ0–DQ15
(A-1)
A0–A18
CE#
OE#
WE#
RESET
BYTE#
RY/BY#
相關(guān)PDF資料
PDF描述
AM29LV800DT-90WCF 8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory
AM29LV800DT-90WCI 8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only Boot Sector Flash Memory
AM29LV800DT-120ED Ceramic Chip Capacitors / MIL-PRF-55681; Capacitance [nom]: 1800pF; Working Voltage (Vdc)[max]: 100V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: X7R (BX); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: 100% Tin (Sn); Body Dimensions: 0.080" x 0.050" x 0.055"; Container: Bag; Features: MIL-PRF-55681: P Failure Rate
AM29N323D 32 Megabit (2 M x 16-Bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst Mode Flash Memory
AM29N323DT11AWKI 32 Megabit (2 M x 16-Bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst Mode Flash Memory
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM29LV800DB-70EF 制造商:Spansion 功能描述:Flash Mem Parallel 3V/3.3V 8M-Bit 1M x 8/512K x 16 70ns 48-Pin TSOP
AM29LV800DB-90EC 制造商:Spansion 功能描述:Flash Mem Parallel 3V/3.3V 8M-Bit 1M x 8/512K x 16 90ns 48-Pin TSOP
AM29LV800DB-90ED 制造商:Spansion 功能描述:Flash Mem Parallel 3V/3.3V 8M-Bit 1M x 8/512K x 16 90ns 48-Pin TSOP
AM29LV800DB90EI 制造商:Advanced Micro Devices 功能描述:
AM29LV800DB-90EI 制造商:Spansion 功能描述:Flash Mem Parallel 3V/3.3V 8M-Bit 1M x 8/512K x 16 90ns 48-Pin TSOP
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