- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄362306 > AMD-K6-2 AMD-K6-2 - AMD-K6-2 Processor Data Sheet PDF資料下載
參數(shù)資料
| 型號： | AMD-K6-2 |
| 英文描述： | AMD-K6-2 - AMD-K6-2 Processor Data Sheet |
| 中文描述： | 的AMD - K6 - 2 -的AMD - K6 - 2處理器數(shù)據(jù)手冊 |
| 文件頁數(shù)： | 13/44頁 |
| 文件大?。?/td> | 2886K |
| 代理商： | AMD-K6-2 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁當前第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁第42頁第43頁第44頁
Heat Sinks
5
20092B/0—Sep1996
AMD-K5 Processor Thermal Considerations
I
θ
jc
is the thermal resistance from junction to case
θ
cs
is the thermal resistance from case to heat sink
θ
sa
is the thermal resistance from heat sink to ambient air
I
I
The above relationship can also be stated in the following
forms:
Equation 3 P
max
= (T
c
- T
a
) / (
θ
cs
+
θ
sa
)
Equation 4 P
max
= (T
s
- T
a
) / (
θ
sa
)
where
I
T
c
is the case temperature of the AMD-K5 processor
T
s
is the heat sink temperature
I
The heat sink selection process requires knowledge of the fol-
lowing system variables:
I
Available volume of space to be occupied without interfer-
ence of other system components (e.g., personal computer
expansion cards, side walls of enclosure, peripherals,
cables, etc.)
The maximum allowable device junction temperature of
the processor die
The maximum power dissipation of the processor
The device configuration (package size and orientation of
the package)
Ambient conditions (temperature, air velocity, and airflow
direction)
I
I
I
I
Types of Heat Sinks
The most frequently used heat sinks for processor cooling
applications are discussed in the following sections. These heat
sinks are designed to transfer heat from the processor into the
air inside a personal computer case. Several manufacturers
offer standard, cost effective, aluminum products (e.g.,
extruded, pin fin, die cast), composition products, and custom
products. Each heat sink should have the following items spec-
ified: thermal resistance (i.e., natural and forced air), size
(length, width, and height), and weight. Many heat sink prod-
uct families have one standard shape and varying heights
相關PDF資料 |
PDF描述 |
|---|---|
| AMD-K6-2E | AMD-K6-2E - AMD-K6-2E Embedded Processor Data Sheet |
| AMD-K6-III | AMD-K6-III - AMD-K6-III Processor Data Sheet |
| AMD-K6-III-P | Mobile AMD-K6?-III-P Processor Data Sheet |
| AMD-K7500MTR51BC | MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
| AMD-K7550MTR51BA | MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| AMD-K6-2/300AFR | 制造商:Advanced Micro Devices 功能描述:Microprocessor, 32 Bit, 321 Pin, Ceramic, PGA |
| AMDK62/350AFK | 制造商:Advanced Micro Devices 功能描述: |
| AMD-K6-2/400ACR | 制造商:Advanced Micro Devices 功能描述:32-BIT, 400 MHZ, RISC PROCESSOR, CPGA321 |
| AMD-K6-2/500AFX | 制造商:Advanced Micro Devices 功能描述:32-BIT, 500 MHz, RISC PROCESSOR, CPGA321 |
| AMD-K6-2+/450ACR | 制造商:Advanced Micro Devices 功能描述:32-BIT, 450 MHZ, RISC PROCESSOR, CPGA321 |
發(fā)布緊急采購，3分鐘左右您將得到回復。