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參數(shù)資料
| 型號： | AMD-K6-2 |
| 英文描述： | AMD-K6-2 - AMD-K6-2 Processor Data Sheet |
| 中文描述： | 的AMD - K6 - 2 -的AMD - K6 - 2處理器數(shù)據(jù)手冊 |
| 文件頁數(shù)： | 21/44頁 |
| 文件大?。?/td> | 2886K |
| 代理商： | AMD-K6-2 |
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Thermal Interfaces
13
20092B/0—Sep1996
AMD-K5 Processor Thermal Considerations
Thermal Interfaces
Thermal interface between the case and heat sink is controlled
in a variety of ways using different heat conducting materials.
The interface resistance between the case and the heat sink is
dependent on three variables: p (the thermal resistance of the
interface material in units of (
o
C · inch
2
) / (watts · thickness in
inches)), t (the average material thickness in inches), and A
(the area of contact in square inches). These variables are
related in the following equation:
Equation 5
θ
cs
= (p · t ) / A
Table 2 contains typical thermal resistance values for materi-
als used in cooling solutions for semiconductors.
The thermal interface material is placed between the top of
the AMD-K5 processor case and the bottom plate of the heat
sink. It is recommended that the heat sink plate have a flatness
tolerance of 0.002
′′
to 0.003
′′
per inch. The thickness of the
thermal interface material should be minimized to obtain the
lowest possible thermal resistance. The thermal grease com-
pounds are the best materials for the thermal interface, fol-
lowed by thermal compounds, and then thermal adhesive
Table 2. Thermal Conductivity Values for Materials Used In Cooling
Solutions
Thermal Interface Materials
Thermal Conductivity
(Watts / (Meter ·
o
C)
389
200
220
240
60.5
21
0.5-1.0
0.2
0.15
0.5-1.0
0.026
Copper (pure)
Aluminum (1100 series)
Aluminum (6000 series)
Beryllia
Carbon Steel
Alumina
Anodized Finish
Silicone RTV
Polyimide
Silicone Grease
Dead Air
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMD-K6-2E | AMD-K6-2E - AMD-K6-2E Embedded Processor Data Sheet |
| AMD-K6-III | AMD-K6-III - AMD-K6-III Processor Data Sheet |
| AMD-K6-III-P | Mobile AMD-K6?-III-P Processor Data Sheet |
| AMD-K7500MTR51BC | MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
| AMD-K7550MTR51BA | MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMD-K6-2/300AFR | 制造商:Advanced Micro Devices 功能描述:Microprocessor, 32 Bit, 321 Pin, Ceramic, PGA |
| AMDK62/350AFK | 制造商:Advanced Micro Devices 功能描述: |
| AMD-K6-2/400ACR | 制造商:Advanced Micro Devices 功能描述:32-BIT, 400 MHZ, RISC PROCESSOR, CPGA321 |
| AMD-K6-2/500AFX | 制造商:Advanced Micro Devices 功能描述:32-BIT, 500 MHz, RISC PROCESSOR, CPGA321 |
| AMD-K6-2+/450ACR | 制造商:Advanced Micro Devices 功能描述:32-BIT, 450 MHZ, RISC PROCESSOR, CPGA321 |
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