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參數(shù)資料
| 型號： | AMD-K6-2 |
| 英文描述： | AMD-K6-2 - AMD-K6-2 Processor Data Sheet |
| 中文描述： | 的AMD - K6 - 2 -的AMD - K6 - 2處理器數(shù)據(jù)手冊 |
| 文件頁數(shù)： | 30/44頁 |
| 文件大?。?/td> | 2886K |
| 代理商： | AMD-K6-2 |
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AMD-K5 Processor Thermal Considerations
AMD-K5 Processor Thermal Considerations
20092B/0—Sep1996
Thermal Characterization of the AMD-K5 Processor
296-Pin Ceramic PGA Package
A thermal study was conducted to determine the thermal resis-
tance of the AMD-K5 processor 296-pin grid array ceramic
package. Three heat sinks were evaluated (i.e., heat sinks A, B,
and C). All heat sinks were of the extruded aluminum pin fin
design and were attached with a single clip to the AMD-K5 pro-
cessor socket (AMP Socket 5). The socket was soldered to a six-
layer printed circuit board.
Thermal test dies were mounted inside the processor ceramic
package and were used as the source of the heat dissipation,
simulating heat from the processor. These thermal dies have
power resistors and PN junctions that are used to sense the
junction temperature. The PN junctions were calibrated at the
beginning of the test by accurately measuring voltage drops at
different temperatures.
Type K (alumel/chromel) 40 AWG thermocouples were used to
sense the case, heat sink, and ambient temperatures. Ambient
temperatures were measured away from the processor to avoid
local heating errors. Results of the measurements include cal-
culations of steady state thermal resistance (see Table 6 for
more information).
The heat sinks used in this study were supplied by manufactur-
ers and are representative of fifth-generation pin fin designs.
See Table 5 for heat sink characteristics.
Three types of thermal interface material were used in this
test. The first material was standard silicon oil-based thermal
grease. The second material was fiberglass-reinforced silicone
Table 5. Test Heat Sink Characteristics for Fifth-Generation Processors
Dimensions
(inches)
Manufacturer
Part Number
Comments
Heat Sink A
Base = 1.96 x 2.67
Height = 0.45
Base = 1.96 x 2.675
Height = 0.7
Aavid
022694
124 pin fins
Heat Sink B
Aavid
363324B
132 pin fins
Heat Sink C
Base = 2.1 x 2.1 Height = 1
Wakefield
698-100AB
Penguin Cooler with 132
pin fins
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMD-K6-2E | AMD-K6-2E - AMD-K6-2E Embedded Processor Data Sheet |
| AMD-K6-III | AMD-K6-III - AMD-K6-III Processor Data Sheet |
| AMD-K6-III-P | Mobile AMD-K6?-III-P Processor Data Sheet |
| AMD-K7500MTR51BC | MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
| AMD-K7550MTR51BA | MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMD-K6-2/300AFR | 制造商:Advanced Micro Devices 功能描述:Microprocessor, 32 Bit, 321 Pin, Ceramic, PGA |
| AMDK62/350AFK | 制造商:Advanced Micro Devices 功能描述: |
| AMD-K6-2/400ACR | 制造商:Advanced Micro Devices 功能描述:32-BIT, 400 MHZ, RISC PROCESSOR, CPGA321 |
| AMD-K6-2/500AFX | 制造商:Advanced Micro Devices 功能描述:32-BIT, 500 MHz, RISC PROCESSOR, CPGA321 |
| AMD-K6-2+/450ACR | 制造商:Advanced Micro Devices 功能描述:32-BIT, 450 MHZ, RISC PROCESSOR, CPGA321 |
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