- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄362306 > AMD-K6-2 AMD-K6-2 - AMD-K6-2 Processor Data Sheet PDF資料下載
參數(shù)資料
| 型號： | AMD-K6-2 |
| 英文描述： | AMD-K6-2 - AMD-K6-2 Processor Data Sheet |
| 中文描述： | 的AMD - K6 - 2 -的AMD - K6 - 2處理器數(shù)據(jù)手冊 |
| 文件頁數(shù)： | 42/44頁 |
| 文件大?。?/td> | 2886K |
| 代理商： | AMD-K6-2 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁第35頁第36頁第37頁第38頁第39頁第40頁第41頁當前第42頁第43頁第44頁
34
AMD-K5 Processor Thermal Considerations
AMD-K5 Processor Thermal Considerations
20092B/0—Sep1996
Conclusion (Final Checklist)
When selecting a cooling solution for the AMD-K5 processor it
is important to know the following:
1. Maximum operating clock frequency and maximum case
temperature for the processor. Check the OPN and data
sheet for the latest information.
2. Thermal specification of the desktop personal computer for
both the maximum case inside temperature (e.g., 30
o
C) and
the airflow above the processor socket on the motherboard
(200 lfpm).
3. Select a heat sink or heat sink/fan module that assures a
safe thermal margin (see
Heat Sink Equations
on page 4)
and that fits within the maximum size requirements with a
secure mechanical attachment (e.g., heat sink clip or ther-
mal adhesive tape) to withstand the vibration and shock
requirements of a personal computer system.
4. Select fans that have sealed ball bearings to ensure long life
(e.g., greater than 5 years).
5. Make sure that there are no mechanical restrictions above a
fan heat sink module (e.g., 0.5 in or more).
6. If thermal adhesive tape is used, the following items should
be specified: the tape should be approximately 0.006 and
the top of the ceramic case should be primed to ensure max-
imum bond strength (see
Thermal Adhesive Tape
on page
15).
7. Thermal system measurements are required to ensure that
the processor case doesn’t exceed the maximum case tem-
perature specification (lower case temperatures ensure safe
thermal margins).
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMD-K6-2E | AMD-K6-2E - AMD-K6-2E Embedded Processor Data Sheet |
| AMD-K6-III | AMD-K6-III - AMD-K6-III Processor Data Sheet |
| AMD-K6-III-P | Mobile AMD-K6?-III-P Processor Data Sheet |
| AMD-K7500MTR51BC | MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
| AMD-K7550MTR51BA | MICROPROCESSOR|32-BIT|CMOS|CARD|PLASTIC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMD-K6-2/300AFR | 制造商:Advanced Micro Devices 功能描述:Microprocessor, 32 Bit, 321 Pin, Ceramic, PGA |
| AMDK62/350AFK | 制造商:Advanced Micro Devices 功能描述: |
| AMD-K6-2/400ACR | 制造商:Advanced Micro Devices 功能描述:32-BIT, 400 MHZ, RISC PROCESSOR, CPGA321 |
| AMD-K6-2/500AFX | 制造商:Advanced Micro Devices 功能描述:32-BIT, 500 MHz, RISC PROCESSOR, CPGA321 |
| AMD-K6-2+/450ACR | 制造商:Advanced Micro Devices 功能描述:32-BIT, 450 MHZ, RISC PROCESSOR, CPGA321 |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。