參數(shù)資料
型號: AMD-K6-2
英文描述: AMD-K6-2 - AMD-K6-2 Processor Data Sheet
中文描述: 的AMD - K6 - 2 -的AMD - K6 - 2處理器數(shù)據(jù)手冊
文件頁數(shù): 31/44頁
文件大?。?/td> 2886K
代理商: AMD-K6-2
Thermal Measurement Procedure
23
20092B/0—Sep1996
AMD-K5 Processor Thermal Considerations
interface material (ADUX White Pad by Thermagon, Inc.). The
third material was thermally conductive elastomer (AS-210
Rose Pad by Thermagon, Inc.).
The steady state test results are detailed in Tables 7 through
16. Each table is accompanied by a figure that represents the
test results graphically. Thermal grease is clearly the best ther-
mal interface material. The variation in thermal interface
resistance was caused by the heat sink flatness. Having a heat
sink improved thermal resistance over not having a heat sink.
Heat sinks B and C show similar performance. Heat sink B has
a greater area in contact with the processor case, but heat sink
C is taller. The volume of heat sink B is 3.7 cubic inches and
the volume of heat sink C is 3.8 cubic inches.
Table 6. Table of Thermal Measurements
Parameter
Symbol
Units
Junction to Air
θ
ja
θ
ja
@ 200 linear feet/min (lfpm)
θ
ja
@ 400 lfpm
θ
jc
θ
ca
θ
sa
θ
cs
o
C / Watt
Junction to Airflow
o
C / Watt
Junction to Airflow
o
C / Watt
Junction to Case
o
C / Watt
Case to Ambient
o
C / Watt
Heat Sink to Ambient
o
C / Watt
Case to Heat Sink
o
C / Watt
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