參數(shù)資料
型號(hào): AT91M55800A-33CJ SL383
廠商: Atmel
文件頁數(shù): 18/28頁
文件大小: 0K
描述: IC ARM MCU 16BIT 176BGA
標(biāo)準(zhǔn)包裝: 1,000
系列: AT91
核心處理器: ARM7
芯體尺寸: 16/32-位
速度: 33MHz
連通性: EBI/EMI,SPI,UART/USART
外圍設(shè)備: POR,WDT
輸入/輸出數(shù): 58
程序存儲(chǔ)器類型: ROMless
RAM 容量: 8K x 8
電壓 - 電源 (Vcc/Vdd): 2.7 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 8x10b; D/A 2x10b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 176-LFBGA
包裝: 帶卷 (TR)
配用: AT91EB55-ND - KIT EVAL FOR ARM AT91M55800A
其它名稱: AT91M55800A33CJSL
25
1745FS–ATARM–18-Apr-06
AT91M55800A Summary
10. Soldering Profile
10.1
LQFP Soldering Profile (Green)
Table 10-1 gives the recommended soldering profile from J-STD-020C.
Note:
The package is certified to be backward compatible with Pb/Sn soldering profile.
A maximum of three reflow passes is allowed per component.
10.2
BGA Soldering Profile (RoHS-compliant)
Table 10-2 gives the recommended soldering profile from J-STD-20C.
Note:
It is recommended to apply a soldering temperature higher than 250°C.
A maximum of three reflow passes is allowed per component.
Table 10-1.
Soldering Profile Green Compliant Package
Profile Feature
Green Package
Average Ramp-up Rate (217°C to Peak)
3
° C/sec. max.
Preheat Temperature 175°C ±25°C
180 sec. max.
Temperature Maintained Above 217°C
60 sec. to 150 sec.
Time within 5
° C of Actual Peak Temperature
20 sec. to 40 sec.
Peak Temperature Range
260 +0
° C
Ramp-down Rate
6
° C/sec. max.
Time 25
° C to Peak Temperature
8 min. max.
Table 10-2.
Soldering Profile RoHS Compliant Package
Profile Feature
Convection or IR/Convection
Average Ramp-up Rate (183
° C to Peak)
3
° C/sec. max.
Preheat Temperature 125
° C ±25° C
180 sec. max
Temperature Maintained Above 183
° C
60 sec. to 150 sec.
Time within 5
° C of Actual Peak Temperature
20 sec. to 40 sec.
Peak Temperature Range
260 + 0
° C
Ramp-down Rate
6
° C/sec.
Time 25
° C to Peak Temperature
8 min. max
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