參數(shù)資料
型號(hào)： BXM80526B600128
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 64-BIT, 600 MHz, MICROPROCESSOR, PBGA495
封裝： BGA2-495
文件頁數(shù)： 40/74頁
文件大小： 870K
代理商： BXM80526B600128
Mobile Intel Celeron Processor (0.18) in BGA2 and Micro-PGA2 Packages
at 700MHz, 650 MHz, 600 MHz, 550 MHz, 500 MHz, 450 MHz,
Low-voltage 500 MHz, and Low-voltage 400A MHz
Datasheet
Order#-XXX
38
5.2
Socketable Micro-PGA2 Package Dimensions
The mobile Celeron processor is also packaged in a PPGA-B495 package (also known as Micro-
PGA2) with the back of the processor die exposed on top. Unlike previous mobile processors with
exposed die, the back of the mobile Celeron processor die may be polished and very smooth. The
mechanical specifications for the socketable package are provided in Table 28. Figure 21 shows
the top and side views of the socketable package, and Figure 22 shows the bottom view of the
socketable package. The substrate may only be contacted within the region between the keep-out
outline and the edge of the substrate. The mobile Celeron processor will have one or two label
marks. These label marks will be located along the long edge of the substrate outside of the keep-
out region, and they will not encroach upon the 7-mm by 7-mm squares at the substrate corners.
Unlike the BGA2 package, VID implementation does not require VID pins to be depopulated on
the Micro-PGA2 package.
Table 28. Socketable Micro-PGA2 Package Specification
Symbol
Parameter
Min
Max
Unit
A
Overall Height, top of die to seating plane of interposer
3.13
3.73
mm
A1
Pin Length
1.25 REF
mm
A2
Die Height
0.854 REF
mm
B
Pin Diameter
0.30 REF
mm
D2
Package Width
28.27 REF
mm
D
Die Substrate Width
27.05
27.35
mm
D1
Die Width
8.81 REF (CPUID = 0686h)
9.28 REF (CPUID = 0683h)
9.37 REF (CPUID = 0681h)
mm
E2
Package Length
34.21 REF
mm
E
Die Substrate Length
30.85
31.15
mm
E1
Die Length
10.79 REF (CPUID = 0686h)
11.23 REF (CPUID = 0683h)
11.27 REF (CPUID = 0681h)
mm
e
Pin Pitch
1.27
mm
—
Pin Tip Radial True Position
≤ 0.127 REF
mm
N
Pin Count
495
each
S1
Outer Pin Center to Short Edge of Substrate
2.144 REF
mm
S2
Outer Pin Center to Long Edge of Substrate
1.206 REF
mm
PDIE
Allowable Pressure on the Die for Thermal Solution
—
689
kPa
W
Package Weight
6.2 REF
grams
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BXM80526B700128 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495
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