參數(shù)資料
型號： BXM80526B600128
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 64-BIT, 600 MHz, MICROPROCESSOR, PBGA495
封裝： BGA2-495
文件頁數(shù)： 51/74頁
文件大?。?/td> 870K
代理商： BXM80526B600128
Mobile Intel Celeron Processor (0.18) in BGA2 and Micro-PGA2 Packages
at 700MHz, 650 MHz, 600 MHz, 550 MHz, 500 MHz, 450 MHz,
Low-voltage 500 MHz, and Low-voltage 400A MHz
Datasheet
Order#-XXX
48
6.0
Thermal Specifications
This chapter provides needed data for designing a thermal solution. The mobile Celeron processor
is either a surface mount PBGA-B495 package or a socketable PPGA-B495 package with the back
of the processor die exposed and has a specified operational junction temperature (TJ) limit.
In order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat
pipe, or other heat transfer system) must make firm contact to the exposed processor die. The
processor die must be clean before the thermal solution is attached or the processor may be
damaged.
Table 32. Mobile Celeron Processor Power Specifications
Symbol
Parameter
Min
Typ
1
Max
Unit
Notes
TDP
Thermal Design Power
at 400A MHz & 1.35V
at 500 MHz & 1.35V
at 450 MHz & 1.60V
at 500 MHz & 1.60V
at 550 MHz & 1.60V
at 600 MHz & 1.60V
at 650 MHz & 1.60V
at 700 MHz & 1.60V
—
10.1
12.2
15.5
16.8
18.4
20.0
21.5
23.0
W
at 100°C,
Notes 2, 3
PSGNT
Stop Grant and Auto Halt power
at 1.35V (for 400A MHz, 500 MHz)
at 1.60V (for 450 MHz, 500 MHz, 550 MHz, 600 MHz, 650 MHz)
at 1.60V (for 700 MHz)
—
1.1
1.7
2.7
W
at 50°C,
Note 3
PQS
Quick Start and Sleep power
at 1.35V (for 400A MHz, 500 MHz)
at 1.60V (for 450 MHz, 500 MHz, 550 MHz, 600 MHz, 650 MHz)
at 1.60V (for 700 MHz)
—
0.8
1.3
1.9
W
at 50°C,
Note 3
PDSLP
Deep Sleep power
at 1.35V (for 400A MHz, 500 MHz)
at 1.60V (for 450 MHz, 500 MHz, 550 MHz, 600 MHz, 650 MHz)
at 1.60V (for 700 MHz)
—
0.3
0.5
0.75
W
at 35°C,
Note 3
TJ
Junction Temperature
0
100
°C
Note 4
NOTES:
1.
TDPTYP is a recommendation based on the power dissipation of the processor while executing publicly available software under
normal operating conditions at nominal voltages. Contact your Intel Field Sales Representative for further information.
2.
TDPMAX is a specification of the total power dissipation of the processor while executing a worst-case instruction mix under normal
operating conditions at nominal voltages. It includes the power dissipated by all of the components within the processor. Not 100%
tested. Specified by design/characterization.
3.
Not 100% tested or guaranteed. The power specifications are composed of the current of the processor on the various voltage
planes. These currents are measured and specified at high temperature Table 9. These power specifications are determined by
characterization of the processor currents at higher temperatures.
4.
TJ is measured with the on-die thermal diode.
Table 32 provides the maximum Thermal Design Power (TDPMAX) dissipation and the minimum
and maximum TJ temperatures for the mobile Celeron processor. A thermal solution should be
designed to ensure the junction temperature never exceeds these specifications. If no closed loop
thermal failsafe mechanism (processor throttling) is present to maintain TJ within specification
then the thermal solution should be designed to cool the TDPMAX condition. If a thermal failsafe
mechanism is present then thermal solution could possibly be designed to a typical Thermal
Design Power (TDPTYP). TDPTYP is a thermal design power recommendation based on the power
dissipation of the processor while executing publicly available software under normal operating
conditions at nominal voltages. TDPTYP power is lower than TDPMAX. Contact your Intel Field
Sales Representative for further information.
相關(guān)PDF資料
PDF描述
BXM80526B700128 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495
BXM80526B700 64-BIT, 700 MHz, MICROPROCESSOR, CPGA495
BXM80536GC2100F 32-BIT, 2100 MHz, MICROPROCESSOR, CPGA478
BXM80536GC1800F 32-BIT, 1800 MHz, MICROPROCESSOR, CPGA478
BXM80536GC1600F 32-BIT, 1600 MHz, MICROPROCESSOR, CPGA478
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
BXM80536NC1400ES L7LS 制造商:Intel 功能描述:CELERON M,360,1.40GHZ,1M CACHE, 400MHZ FSB,1.26V,UFCPGA - Boxed Product (Development Kits)
BXMP1000 制造商:SPECTRUM 制造商全稱:Spectrum Microwave, Inc. 功能描述:RF AMPLIFIER
BXMP1001 制造商:SPECTRUM 制造商全稱:Spectrum Microwave, Inc. 功能描述:RF AMPLIFIER
BXMP1002 制造商:SPECTRUM 制造商全稱:Spectrum Microwave, Inc. 功能描述:RF AMPLIFIER
BXMP1003 制造商:SPECTRUM 制造商全稱:Spectrum Microwave, Inc. 功能描述:RF AMPLIFIER
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*