參數(shù)資料
型號: CXK77B3640AGB
廠商: Sony Corporation
英文描述: 4Mb Late Write HSTL High Speed Synchronous SRAM(128K x 36Bit)(4M位、寫延遲、高速邏輯收發(fā)(HSTL)、高速同步靜態(tài)RAM (128K x 36位))
中文描述: 4Mb的后寫入HSTL高速同步SRAM(128K的x 36Bit)(4分位,寫延遲,高速邏輯收發(fā)(HSTL),高速同步靜態(tài)隨機(jī)存儲器(128K的× 36位))
文件頁數(shù): 9/33頁
文件大?。?/td> 284K
代理商: CXK77B3640AGB
4Mb, Sync LW, HSTL, rev 1.5
9 / 33
July 23, 1998
SONY
CXK77B3640AGB / CXK77B1840AGB
Preliminary
Absolute Maximum Ratings
(1)
(1)
Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage
to the device. This is a stress rating only, and functional operation of the device at these or any other
conditions other than those indicated in the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions for extended periods may affect reliability.
PBGA Package Thermal Characteristics
Board size & thickness (Board A, B): 7.62W x 11.43L x 1.57T (mm)
Item
Symbol
Rating
Unit
Supply Voltage
V
DD
V
DDQ
V
IN
V
OUT
T
A
T
J
T
STG
-0.5 to +4.6
V
Output Supply Voltage
-0.5 to +4.6
V
Input Voltage
-0.5 to V
DD
+0.5 (4.6V max.)
-0.5 to V
DDQ
+0.5 (4.6V max.)
0 to 85
V
Output Voltage
V
°
C
°
C
°
C
Operating Temperature
Junction Temperature
0 to 110
Storage Temperature
-55 to 150
Sample Form
Ambient
Air
Flow
(m/s)
Thermal
Resistance
(
°
C/W)
Reference
1
θ
JA
PKG only
Room Temp
0
1
2
3
81.0
36.9
29.5
26.1
Max Thermal Resistance
2
θ
JA
PKG on Board A*
Room Temp
0
1
2
3
32.4
23.8
20.7
18.6
*Board A is a two layer printed circuit
board with very low density trace in
both layers.
3
θ
JA
PKG on Board B**
Room Temp
0
1
2
3
16.0
12.9
12.0
11.3
**Board B is a four layer printed circuit
board, same as Board A except with two
GND planes in the middle layers.
4
θ
JC
PKG only
DI Water
-
3.6
Min Thermal Resistance
相關(guān)PDF資料
PDF描述
CXK77B1840AGB 4Mb Late Write HSTL High Speed Synchronous SRAM(256K x 18Bit)(4M位、寫延遲、高速邏輯收發(fā)(HSTL)、高速同步靜態(tài)RAM (256K x 18位))
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