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| 型號(hào)： | DS3171 |
| 英文描述： | Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers |
| 中文描述： | 單/雙/三/四路、DS3/E3單芯片收發(fā)器 |
| 文件頁(yè)數(shù)： | 84/232頁(yè) |
| 文件大?。?/td> | 2133K |
| 代理商： | DS3171 |
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DS3171/DS3172/DS3173/DS3174
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Table 10-27. C-Bit DS3 Frame Overhead Bit Definitions
Bit
Definition
X
1
, X
2
Remote Defect Indication
(RDI)
P
1
, P
2
Parity Bits
M
1
, M
2
, and M
3
Multiframe Alignment Bits
F
XY
Subframe Alignment Bits
C
11
Application Identification
Channel (AIC)
C
12
Reserved
C
13
Far-End Alarm and Control
(FEAC) signal
C
21
, C
22
, and C
23
Unused
C
31
, C
32
, and C
33
C-bit parity bits
C
41
, C
42
, and C
43
Far-End Block Error (FEBE)
bits
C
51
, C
52
, and C
53
Path Maintenance Data Link
(or HDLC) bits
C
61
, C
62
, and C
63
Unused
C
71
, C
72
, and C
73
Unused
X
1
and X
2
are the Remote Defect Indication (RDI) bits (also referred to as the far-end SEF/AIS bits). P
1
and P
2
are
the parity bits used for line error monitoring. M
1
, M
2
, and M
3
are the multiframe alignment bits. F
XY
are the subframe
alignment bits. C
11
is the Application Identification Channel (AIC). C
12
is reserved for future network use, and has a
value of one. C
13
is the Far-End Alarm and Control (FEAC) signal. C
21
, C
22
, and C
23
are unused, and have a value
of one. C
31
, C
32
, and C
33
are the C-bit parity bits used for path error monitoring. C
41
, C
42
, and C
43
are the Far-End
Block Error (FEBE) bits used for remote path error monitoring. C
51
, C
52
, and C
53
are the path maintenance data link
(or HDLC) bits. C
61
, C
62
, and C
63
are unused, and have a value of one. C
71
, C
72
, and C
73
are unused, and have a
value of one. The X-bit, P-bit, M-bit, C-bit, and F-bit positions are overhead bits, and the other bit positions in the
T3 frame are payload bits regardless of how they are marked by TDEN.
10.6.5.2 Transmit C-bit DS3 Frame Generation
C-bit DS3 frame generation receives the incoming payload data stream, and overwrites all of the overhead bit
locations.
The multiframe alignment bits (M
1
, M
2
, and M
3
) are overwritten with the values zero, one, and zero (010)
respectively.
The subframe alignment bits (F
X1
, F
X2
, F
X3
, and F
X4
) are overwritten with the values one, zero, zero, and one (1001)
respectively.
The X-bits (X
1
and X
2
) are both overwritten with the Remote Defect Indicator (RDI). The RDI source is
programmable (automatic, 1, or 0). If the RDI is generated automatically, the X-bits are set to zero when one or
more of the indicated alarm conditions is present, and set to one when all of the indicated alarm conditions are
absent. Automatically setting RDI on LOS, SEF, LOF, or AIS is individually programmable (on or off).
The P-bits (P
1
and P
2
) are both overwritten with the calculated payload parity from the previous DS3 frame. The
payload parity is calculated by performing modulo 2 addition of all of the payload bits after all frame processing has
been completed. P-bit generation is programmable (on or off). The P-bits will be generated if either P-bit generation
is enabled or frame generation is enabled.
The bits C
11
, C
12
, C
21
, C
22
, C
23
, C
61
, C
62
, C
63
, C
71
, C
72
, and C
73
are all overwritten with a one.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| DS3171N | Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers |
| DS3172 | Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers |
| DS3172N | Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers |
| DS3173 | Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers |
| DS3173N | Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| DS3171N | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Single DS3/E3 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS3171N+ | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Single DS3/E3 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS3172 | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Dual DS3/E3 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS3172+ | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Dual DS3/E3 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
| DS3172N | 功能描述:網(wǎng)絡(luò)控制器與處理器 IC Dual DS3/E3 Single Chip Transceiver RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray |
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