參數(shù)資料
型號： DSP56F801
廠商： 飛思卡爾半導體(中國)有限公司
英文描述： 16-bit Hybrid Controller(16位混合控制器)
中文描述： 16位混合控制器（16位混合控制器）
文件頁數(shù)： 39/44頁
文件大小： 858K
代理商： DSP56F801
Thermal Design Considerations
56F801 Technical Data
39
Part 5 Design Considerations
5.1 Thermal Design Considerations
An estimation of the chip junction temperature, T
J
, in
°
C can be obtained from the equation:
Equation 1:
Where:
T
A
= ambient temperature °C
R
θ
JA
= package junction-to-ambient thermal resistance °C/W
P
D
= power dissipation in package
Historically, thermal resistance has been expressed as the sum of a junction-to-case thermal resistance and
a case-to-ambient thermal resistance:
Equation 2:
Where:
R
θ
JA
= package junction-to-ambient thermal resistance °C/W
R
θ
JC
= package junction-to-case thermal resistance °C/W
R
θ
CA
= package case-to-ambient thermal resistance °C/W
R
θ
JC
is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, R
θ
CA
. For example, the user can change the air flow around
the device, add a heat sink, change the mounting arrangement on the Printed Circuit Board (PCB), or
otherwise change the thermal dissipation capability of the area surrounding the device on the PCB. This
model is most useful for ceramic packages with heat sinks; some 90% of the heat flow is dissipated through
the case to the heat sink and out to the ambient environment. For ceramic packages, in situations where the
heat flow is split between a path to the case and an alternate path through the PCB, analysis of the device
thermal performance may need the additional modeling capability of a system level thermal simulation tool.
The thermal performance of plastic packages is more dependent on the temperature of the PCB to which the
package is mounted. Again, if the estimations obtained from R
θ
JA
do not satisfactorily answer whether the
thermal performance is adequate, a system level model may be appropriate.
Definitions:
A complicating factor is the existence of three common definitions for determining the junction-to-case
thermal resistance in plastic packages:
Measure the thermal resistance from the junction to the outside surface of the package (case) closest
to the chip mounting area when that surface has a proper heat sink. This is done to minimize
temperature variation across the surface.
Measure the thermal resistance from the junction to where the leads are attached to the case. This
definition is approximately equal to a junction to board thermal resistance.
Use the value obtained by the equation (T
J
– T
T
)/P
D
where T
T
is the temperature of the package
case determined by a thermocouple.
T
J
T
A
P
D
R
θ
JA
×
(
)
+
=
R
θ
JA
R
θ
JC
R
θ
CA
+
=
F
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
.
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相關代理商/技術參數(shù)
參數(shù)描述
DSP56F801-7UM 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:16-bit Digital Signal Controllers
DSP56F801E 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:56F801 16-bit Hybrid Controller
DSP56F801EVM 功能描述:開發(fā)板和工具包 - 其他處理器 Evaluation Kit For DSP56F801 RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
DSP56F801EVMUM 制造商:未知廠家 制造商全稱:未知廠家 功能描述:56F801 Evaluation Module Hardware User＇s Manual
DSP56F801FA60 功能描述:數(shù)字信號處理器和控制器 - DSP, DSC 60Mhz/30MIPS RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時器數(shù)量:3 設備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風格:SMD/SMT
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