參數(shù)資料
型號(hào)： DSPIC30F3013-30I/SP
廠商： Microchip Technology
文件頁(yè)數(shù)： 117/161頁(yè)
文件大小： 0K
描述： IC DSPIC MCU/DSP 24K 28DIP
產(chǎn)品培訓(xùn)模塊： Serial Communications using dsPIC30F I2C
Serial Communications using dsPIC30F SPI
Serial Communications using dsPIC30F UART
dsPIC30F 12 bit ADC - Part 2
dsPIC30F Addressing Modes - Part 1
dsPIC30F Architecture - Part 1
dsPIC30F DSP Engine & ALU
dsPIC30F Interrupts
dsPIC30F Motor Control PWM
dsPIC Timers
Asynchronous Stimulus
dsPIC30F Addressing Modes - Part 2
dsPIC30F Architecture - Part 2
dsPIC30F 12-bit ADC Part 1
標(biāo)準(zhǔn)包裝： 15
系列： dsPIC™ 30F
核心處理器： dsPIC
芯體尺寸： 16-位
速度： 30 MIP
連通性： I²C，SPI，UART/USART
外圍設(shè)備： 欠壓檢測(cè)/復(fù)位，POR，PWM，WDT
輸入/輸出數(shù)： 20
程序存儲(chǔ)器容量： 24KB（8K x 24）
程序存儲(chǔ)器類型： 閃存
EEPROM 大?。?/td> 1K x 8
RAM 容量： 2K x 8
電壓 - 電源 (Vcc/Vdd)： 2.5 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 10x12b
振蕩器型： 內(nèi)部
工作溫度： -40°C ~ 85°C
封裝/外殼： 28-DIP（0.300"，7.62mm）
包裝： 管件
產(chǎn)品目錄頁(yè)面： 651 (CN2011-ZH PDF)
配用： DV164005-ND - KIT ICD2 SIMPLE SUIT W/USB CABLE
其它名稱： DSPIC30F301330ISP
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)第32頁(yè)第33頁(yè)第34頁(yè)第35頁(yè)第36頁(yè)第37頁(yè)第38頁(yè)第39頁(yè)第40頁(yè)第41頁(yè)第42頁(yè)第43頁(yè)第44頁(yè)第45頁(yè)第46頁(yè)第47頁(yè)第48頁(yè)第49頁(yè)第50頁(yè)第51頁(yè)第52頁(yè)第53頁(yè)第54頁(yè)第55頁(yè)第56頁(yè)第57頁(yè)第58頁(yè)第59頁(yè)第60頁(yè)第61頁(yè)第62頁(yè)第63頁(yè)第64頁(yè)第65頁(yè)第66頁(yè)第67頁(yè)第68頁(yè)第69頁(yè)第70頁(yè)第71頁(yè)第72頁(yè)第73頁(yè)第74頁(yè)第75頁(yè)第76頁(yè)第77頁(yè)第78頁(yè)第79頁(yè)第80頁(yè)第81頁(yè)第82頁(yè)第83頁(yè)第84頁(yè)第85頁(yè)第86頁(yè)第87頁(yè)第88頁(yè)第89頁(yè)第90頁(yè)第91頁(yè)第92頁(yè)第93頁(yè)第94頁(yè)第95頁(yè)第96頁(yè)第97頁(yè)第98頁(yè)第99頁(yè)第100頁(yè)第101頁(yè)第102頁(yè)第103頁(yè)第104頁(yè)第105頁(yè)第106頁(yè)第107頁(yè)第108頁(yè)第109頁(yè)第110頁(yè)第111頁(yè)第112頁(yè)第113頁(yè)第114頁(yè)第115頁(yè)第116頁(yè)當(dāng)前第117頁(yè)第118頁(yè)第119頁(yè)第120頁(yè)第121頁(yè)第122頁(yè)第123頁(yè)第124頁(yè)第125頁(yè)第126頁(yè)第127頁(yè)第128頁(yè)第129頁(yè)第130頁(yè)第131頁(yè)第132頁(yè)第133頁(yè)第134頁(yè)第135頁(yè)第136頁(yè)第137頁(yè)第138頁(yè)第139頁(yè)第140頁(yè)第141頁(yè)第142頁(yè)第143頁(yè)第144頁(yè)第145頁(yè)第146頁(yè)第147頁(yè)第148頁(yè)第149頁(yè)第150頁(yè)第151頁(yè)第152頁(yè)第153頁(yè)第154頁(yè)第155頁(yè)第156頁(yè)第157頁(yè)第158頁(yè)第159頁(yè)第160頁(yè)第161頁(yè)
dsPIC30F2011/2012/3012/3013
DS70139G-page 44
2010 Microchip Technology Inc.
4.1.3
MOVE AND ACCUMULATOR
INSTRUCTIONS
Move instructions and the DSP accumulator class of
instructions provide a greater degree of addressing
flexibility than other instructions. In addition to the
addressing
modes
supported
by
most
MCU
instructions, move and accumulator instructions also
support
Register
Indirect
with
Register
Offset
Addressing mode, also referred to as Register Indexed
mode.
In summary, the following addressing modes are
supported by move and accumulator instructions:
Register Direct
Register Indirect
Register Indirect Post-modified
Register Indirect Pre-modified
Register Indirect with Register Offset (Indexed)
Register Indirect with Literal Offset
8-bit Literal
16-bit Literal
4.1.4
MAC
INSTRUCTIONS
The dual source operand DSP instructions (CLR, ED,
EDAC, MAC, MPY, MPY.N, MOVSAC
and MSC), also
referred to as MAC instructions, utilize a simplified set of
addressing modes to allow the user to effectively
manipulate the data pointers through register indirect
tables.
The two source operand prefetch registers must belong
to the set {W8, W9, W10, W11}. For data reads, W8
and W9 are always directed to the X RAGU. W10 and
W11 are always directed to the Y AGU. The effective
addresses generated (before and after modification)
must, therefore, be valid addresses within X data space
for W8 and W9 and Y data space for W10 and W11.
In summary, the following addressing modes are
supported by the MAC class of instructions:
Register Indirect
Register Indirect Post-modified by 2
Register Indirect Post-modified by 4
Register Indirect Post-modified by 6
Register Indirect with Register Offset (Indexed)
4.1.5
OTHER INSTRUCTIONS
Besides the various addressing modes outlined above,
some instructions use literal constants of various sizes.
For example, BRA (branch) instructions use 16-bit
signed literals to specify the branch destination directly,
whereas the DISI instruction uses a 14-bit unsigned
literal field. In some instructions, such as ADD Acc, the
source of an operand or result is implied by the opcode
itself. Certain operations, such as NOP, do not have any
operands.
4.2
Modulo Addressing
Modulo Addressing is a method of providing an
automated means to support circular data buffers using
hardware. The objective is to remove the need for
software to perform data address boundary checks
when executing tightly looped code, as is typical in
many DSP algorithms.
Modulo Addressing can operate in either data or
program space (since the data pointer mechanism is
essentially the same for both). One circular buffer can
be supported in each of the X (which also provides the
pointers into program space) and Y data spaces.
Modulo Addressing can operate on any W register
pointer. However, it is not advisable to use W14 or W15
for Modulo Addressing since these two registers are
used as the Stack Frame Pointer and Stack Pointer,
respectively.
In general, any particular circular buffer can only be
configured to operate in one direction, as there are
certain
restrictions on the
buffer
Start
address
(for incrementing
buffers),
or
end
address
(for decrementing buffers) based upon the direction of
the buffer.
The only exception to the usage restrictions is for
buffers that have a power-of-2 length. As these buffers
satisfy the Start and the end address criteria, they can
operate in a Bidirectional mode (i.e., address boundary
checks are performed on both the lower and upper
address boundaries).
Note:
For the MOV instructions, the addressing
mode specified in the instruction can differ
for
the
source
and
destination
EA.
However, the 4-bit Wb (register offset)
field is shared between both source and
destination (but typically only used by
one).
Note:
Not
all
instructions
support
all
the
addressing modes given above. Individual
instructions may support different subsets
of these addressing modes.
Note:
Register Indirect with Register Offset
addressing is only available for W9 (in X
space) and W11 (in Y space).
相關(guān)PDF資料
PDF描述
DSPIC33FJ32MC202-E/SO IC DSPIC MCU/DSP 32K 28SOIC
52745-0896 CONN FFC 8POS .5MM R/A ZIF SMD
52745-0496 CONN FFC 4POS .5MM R/A ZIF SMD
TS87C58X2-LCE IC MCU 8BIT 32K OTP 30MHZ 44VQFP
TS87C54X2-VCE IC MCU 8BIT 16K OTP 40MHZ 44VQFP
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
dsPIC30F3013T-20E/ML 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 44LD 20MIPS 24 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
dsPIC30F3013T-20E/SO 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 28LD 20MIPS 24 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
dsPIC30F3013T-20I/ML 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 44LD 20MIPS 24 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
DSPIC30F3013T-20I/SO 功能描述:IC DSPIC MCU/DSP 24K 28SOIC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微控制器， 系列:dsPIC™ 30F 產(chǎn)品培訓(xùn)模塊:XLP Deep Sleep Mode 8-bit PIC® Microcontroller Portfolio 標(biāo)準(zhǔn)包裝:22 系列:PIC® XLP™ 18F 核心處理器:PIC 芯體尺寸:8-位 速度:48MHz 連通性:I²C，SPI，UART/USART，USB 外圍設(shè)備:欠壓檢測(cè)/復(fù)位，POR，PWM，WDT 輸入/輸出數(shù):14 程序存儲(chǔ)器容量:8KB（4K x 16） 程序存儲(chǔ)器類型:閃存 EEPROM 大小:256 x 8 RAM 容量:512 x 8 電壓 - 電源 (Vcc/Vdd):1.8 V ~ 5.5 V 數(shù)據(jù)轉(zhuǎn)換器:A/D 11x10b 振蕩器型:內(nèi)部 工作溫度:-40°C ~ 85°C 封裝/外殼:20-DIP（0.300"，7.62mm） 包裝:管件 產(chǎn)品目錄頁(yè)面:642 (CN2011-ZH PDF) 配用:DV164126-ND - KIT DEVELOPMENT USB W/PICKIT 2DM164127-ND - KIT DEVELOPMENT USB 18F14/13K50AC164112-ND - VOLTAGE LIMITER MPLAB ICD2 VPP
dsPIC30F3013T-30I/ML 功能描述:數(shù)字信號(hào)處理器和控制器 - DSP, DSC 44LD 30MIPS 24 KB RoHS:否 制造商:Microchip Technology 核心:dsPIC 數(shù)據(jù)總線寬度:16 bit 程序存儲(chǔ)器大小:16 KB 數(shù)據(jù) RAM 大小:2 KB 最大時(shí)鐘頻率:40 MHz 可編程輸入/輸出端數(shù)量:35 定時(shí)器數(shù)量:3 設(shè)備每秒兆指令數(shù):50 MIPs 工作電源電壓:3.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TQFP-44 安裝風(fēng)格:SMD/SMT
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*