參數(shù)資料
型號(hào): EPM7064AETI44-7N
廠商: Altera
文件頁(yè)數(shù): 7/64頁(yè)
文件大?。?/td> 0K
描述: IC MAX 7000 CPLD 64 44-TQFP
產(chǎn)品變化通告: Bond Wire Change 4/Sept/2008
標(biāo)準(zhǔn)包裝: 480
系列: MAX® 7000A
可編程類型: 系統(tǒng)內(nèi)可編程
最大延遲時(shí)間 tpd(1): 7.5ns
電壓電源 - 內(nèi)部: 3 V ~ 3.6 V
邏輯元件/邏輯塊數(shù)目: 4
宏單元數(shù): 64
門數(shù): 1250
輸入/輸出數(shù): 36
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 44-TQFP
供應(yīng)商設(shè)備封裝: 44-TQFP(10x10)
包裝: 托盤
產(chǎn)品目錄頁(yè)面: 604 (CN2011-ZH PDF)
其它名稱: 544-2011
EPM7064AETI44-7N-ND
Altera Corporation
15
MAX 7000A Programmable Logic Device Data Sheet
SameFrame
Pin-Outs
MAX 7000A devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support a range of devices from an EPM7128AE device in a 100-pin
FineLine BGA package to an EPM7512AE device in a 256-pin
FineLine BGA package.
The Altera design software provides support to design PCBs with
SameFrame pin-out devices. Devices can be defined for present and future
use. The software generates pin-outs describing how to lay out a board to
take advantage of this migration (see Figure 7).
Figure 7. SameFrame Pin-Out Example
Designed for 256-Pin FineLine BGA Package
Printed Circuit Board
100-Pin FineLine BGA Package
(Reduced I/O Count or
Logic Requirements)
256-Pin FineLine BGA Package
(Increased I/O Count or
Logic Requirements)
100-Pin
FineLine
BGA
256-Pin
FineLine
BGA
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