
AMERICAN MICROSYSTEMS, INC.
September 2000
9.18.00
6
FS6232-01
Two-Way MP Motherboard Clock Generator IC
ISO9001
6.0 Electrical Specifications
Table 10: Absolute Maximum Ratings
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. These conditions represent a stress rating only, and functional operation of the device at
these or any other conditions above the operational limits noted in this specification is not implied. Exposure to maximum rating conditions for extended conditions may affect device performance,
functionality, and reliability.
PARAMETER
SYMBOL
MIN.
MAX.
UNITS
Supply Voltage (V
SS
= ground)
V
DD
V
SS
-0.5
7
V
Input Voltage, dc
V
I
V
SS
-0.5
V
DD
+0.5
V
Output Voltage, dc
V
O
V
SS
-0.5
V
DD
+0.5
V
Input Clamp Current, dc (V
I
< 0 or V
I
> V
DD
)
I
IK
-50
50
mA
Output Clamp Current, dc (V
I
< 0 or V
I
> V
DD
)
I
OK
-50
50
mA
Storage Temperature Range (non-condensing)
T
S
-65
150
°C
Ambient Temperature Range, Under Bias
T
A
-55
125
°C
Junction Temperature
T
J
125
°C
Lead Temperature (soldering, 10s)
260
°C
Input Static Discharge Voltage Protection (MIL-STD 883E, Method 3015.7)
2
kV
CAUTION: ELECTROSTATIC SENSITIVE DEVICE
Permanent damage resulting in a loss of functionality or performance may occur if this device is subjected to a high-energy elec-
trostatic discharge.
Table 11: Operating Conditions
PARAMETER
SYMBOL
CONDITIONS/DESCRIPTION
MIN.
TYP.
MAX.
UNITS
Core (VDD)
3.135
3.3
3.465
Supply Voltage
V
DD
Clock Buffers (VDD_48, VDD_66, VDD_H,
VDD_M, VDD_P, VDD_R)
3.135
3.3
3.465
V
Operating Temperature Range
T
A
0
70
°C
Crystal Resonator Frequency
f
XTAL
14.316
14.318
14.32
MHz
Crystal Resonator Load Capacitance
C
XL
XIN, XOUT pins
13.5
18
22.5
pF
MREF_P, MREF_N
10
30
PCI_0:9
10
30
CK66_0:3
10
30
CK48_0:1
10
20
Load Capacitance
C
L
REF_0:1
10
20
pF
Load Resistance
R
L
HOST_P1 to HOST_P4,
HOST_N1 to HOST_N4
20
105
Maximum High-Level Output Voltage
V
OH
HOST_P1 to HOST_P4,
HOST_N1 to HOST_N4
1.20
V