Intel
80200 Processor based on Intel
XScale
Microarchitecture
Datasheet
August 2002
3
Contents
1.0
About this Document..........................................................................................................5
2.0
Functional Overview...........................................................................................................5
2.1
Superpipeline ........................................................................................................7
2.2
Branch Target Buffer (BTB)...................................................................................8
2.3
Instruction Memory Management Unit (IMMU) .....................................................8
2.4
Data Memory Management Unit (DMMU).............................................................9
2.5
Instruction Cache (I-Cache) ..................................................................................9
2.6
Data Cache (D-Cache)........................................................................................10
2.7
Mini-Data Cache..................................................................................................10
2.8
Fill Buffer (FB) and Pend Buffer (PB)..................................................................11
2.9
Write Buffer (WB) ................................................................................................11
2.10
Multiply-Accumulate Coprocessor (CP0) ............................................................11
2.11
Clock and Power Management...........................................................................12
2.12
Performance Monitoring Unit (PMU) ...................................................................12
2.13
Debug Unit ..........................................................................................................12
3.0
Package Information ........................................................................................................13
3.1
Package Introduction...........................................................................................13
3.1.1
Functional Signal Definitions..................................................................13
3.1.1.1 Signal Pin Descriptions .............................................................13
3.1.2
241 Lead PBGA Package ......................................................................17
3.2
Package Thermal Specifications.........................................................................22
3.3
Package Thermal Resistance .............................................................................22
4.0
Electrical Specifications....................................................................................................24
4.1
Absolute Maximum Ratings.................................................................................24
4.2
V
CCA
Pin Requirements ......................................................................................25
4.3
Targeted DC Specifications.................................................................................26
4.4
Targeted AC Specifications.................................................................................27
4.4.1
Clock Signal Timings..............................................................................27
4.4.2
Bus Signal Timings.................................................................................28
4.4.3
Boundary Scan Test Signal Timings ......................................................29
4.5
AC Timing Waveforms ........................................................................................30
4.6
Power Sequence.................................................................................................32
4.7
Reset Timing .......................................................................................................34
4.8
AC Test Conditions .............................................................................................34
4.9
Typical Power Dissipation ...................................................................................35